Semiconductor News & Analysis Feed
118 articles
2026-05-28
digitimes.com
2026-05-28
Shiny Chemical Industrial said demand for its electronic-grade products is being driven mainly by advanced semiconductor processes, AI, and high-performance computing, with its share of revenue continuing to rise. The company has begun expanding capacity for its electronic-grade isopropyl alcohol (IPA) and propylene glycol methyl ether (PM) lines.
2026-05-28
digitimes.com
2026-05-28
Synopsys reported divergent regional performance in the second quarter, with China showing sequential growth while North America and Europe declined, as demand patterns for semiconductor design tools and simulation software remained uneven across end markets.
2026-05-28
digitimes.com
2026-05-28
Solidigm, the enterprise storage brand under SK Hynix, announced a leadership reshuffle this spring, naming two executives as co-chief executive officers to divide responsibilities between global operations and commercial growth. One co-CEO was appointed in March 2026, and the other took office on May 1, with leadership stating the change aims to accelerate product execution and business performan
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-28
www.gurufocus.com
2026-05-28
GuruFocus
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2026-05-27
eetimes.com
2026-05-27
This paper explores how configurable and intelligent I/O technologies are transforming industrial control systems by enabling greater flexibility, improved thermal performance, and higher system uptime. Traditional fixed-function I/O architectures, while effective in stable environments, create inefficiencies through SKU proliferation, underutilized channels, and limited adaptability to late-stage
2026-05-27
www.digitimes.com
2026-05-27
digitimes
TSMC chairman and CEO C.C. Wei personally addressed employees at a company-wide meeting on the morning of May 27, making a direct commitment on bonuses after days of backlash over reports of a 15% cut.
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2026-05-27
digitimes.com
2026-05-27
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage
2026-05-27
digitimes.com
2026-05-27
Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The firm highlighted that as AI expands to endpoint applications, performance and s
2026-05-27
digitimes.com
2026-05-27
TSMC chairman and CEO C.C. Wei addressed employees at a company-wide meeting on May 27, making a direct commitment on bonuses after days of backlash over reports of a 15% cut.
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
NVIDIA CompileIQ tackles one of the hardest problems in performance engineering: finding the compiler options that unlock the best performance for a specific workload.
Consider a team that has spent weeks optimizing an LLM inference pipeline on GPUs, tuning batch sizes, quantizing to FP8, adopting flash attention, fusing every kernel they can. The profiler says there’s nothing left to squeeze.
B
2026-05-27
developer.nvidia.com
2026-05-27
NVIDIA Developer
Developers can now use NVIDIA CUDA Tile programming within large existing C++ GPU codebases to develop highly optimized GPU kernels using tile-based abstractions.
NVIDIA CUDA Tile, launched with NVIDIA CUDA 13.1, introduced tile-based programming for GPUs. Designed with a top-level language layer and another intermediate layer that any high-level programming language can target, CUDA Tile autom
2026-05-27
aws.amazon.com
2026-05-27
Amazon Web Services (AWS)
Build high-performance generative AI systems with Strands Agents, NVIDIA NIM, and Amazon Bedrock AgentCore
by Kanishk Mahajan and Akshay Parkhi on 26 MAY 2026 in Amazon Bedrock Agents, Best Practices, Strands Agents, Technical How-to, Thought Leadership Permalink Comments Share
Building high-performance generative AI agents requires architecture that can deliver fast inference, coordinate multi
2026-05-26
www.phoronix.com
2026-05-26
Phoronix
NVIDIA Vera CPU Benchmarks: Olympus Cores Delivering The Best Performance Ever Seen On ARM
Written by Michael Larabel in Processors on 26 May 2026 at 10:00 AM EDT. Page 1 of 11. Add A Comment.
NVIDIA's Vera data center CPU isn't ramping up until later this year but I recently had the opportunity to try out this new ARM-based CPU designed for agentic AI workloads. NVIDIA's Vera CPU with its in-hou
2026-05-26
eetimes.com
2026-05-26
Huawei's answer to Moore's Law without EUV promises 14A performance by 2031.
2026-05-26
www.benzinga.com
2026-05-26
Benzinga
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2026-05-26
www.cnbc.com
2026-05-26
CNBC
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2026-05-26
technode.global
2026-05-26
TNGlobal
SK hynix unveils ‘iHBM’ thermal solution to boost AI performance
MAY 26, 2026|BY LIUTENG
Enhances heat dissipation by integrating ICEs into the HBM package
Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments
Lowers barriers to adoption by leveraging market-proven MR–MUF technology, featuring high design compatibility
SEOUL
2026-05-26
www.techpowerup.com
2026-05-26
TechPowerUp
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2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo