Semiconductor News & Analysis Feed
118 articles
2026-06-15
wccftech.com
2026-06-15
Wccftech
The 2nm GAA process is slowly gaining traction through improved yields, with Samsung’s more mature 4nm and 8nm nodes increasing in utilization, becoming one of the reasons why the Korean giant is slowly approaching the path of profitability. Unfortunately, there’s always some resistance in the way, and according to the company’s semiconductor head, it’s performance-based bonuses and a mobile-centr
2026-06-15
www.megabites.com.ph
2026-06-15
megabites.com.ph
Cadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications. This design win marks a significant step in delivering high-performance, low-power lidar systems optimized for rea
2026-06-15
digitimes.com
2026-06-15
INPAQ Technology, a unit of PSA Walsin Technology, reported that revenue and profit in the first quarter of 2026 fell year on year, citing a supply-demand imbalance in the memory market and sharp raw material price increases. The company said it expected a gradual recovery in the second half of 2026 as industry inventories normalized and new products and customers began contributing. INPAQ also ou
2026-06-15
digitimes.com
2026-06-15
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and i
2026-06-15
digitimes.com
2026-06-15
Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward profitability as demand builds across high-performance computing and emerging technology markets.
2026-06-15
www.digitaltrends.com
2026-06-15
Digital Trends
Making chips smaller has dominated the semiconductor conversation for years, but TSMC’s next big leap may come from how those chips are packaged instead. According to analyst Ming-Chi Kuo, the company is developing a new Chip-on-Panel-on-Substrate, or CoPoS, technology that promises lower manufacturing costs while delivering better performance for future AI processors.
TSMC’s CoPoS packaging coul
2026-06-15
news.google.com
2026-06-15
The Motley Fool
2026-06-14
wccftech.com
2026-06-14
Wccftech
NVIDIA's Blackwell GB300 has posted record performance in AA-AgentPerf, a new benchmark that measures Agentic AI workflows.
Artificial Analysis has a new benchmark out called AA-AgentPerf, which measures how many active agents an inference deployment can support under realistic workloads, which include:
The AA-AgentPerf benchmark is used to measure three key metrics, which form the basis of mode
2026-06-13
tomshardware.com
2026-06-13
Mark Tyson
A new and unique video streaming solution is pitched as a 'high-performance, real-time ASCII video rendering engine' that can be used to broadcast 'an unblockable video stream.'
2026-06-13
developer.nvidia.com
2026-06-13
NVIDIA Developer
AI agents have fundamentally changed the complexity of inference workloads. Until now, the industry has struggled to define a standard for measuring how inference systems perform under these conditions. Artificial Analysis AgentPerf (AA-AgentPerf) offers the industry’s first multi-vendor open benchmarks profiling trajectories that are representative of real-world AI agent coding tasks.
This post
2026-06-12
www.benzinga.com
2026-06-12
Benzinga
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2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-12
digitimes.com
2026-06-12
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness as chipmakers race to bring next-generation technologies to market.
2026-06-12
digitimes.com
2026-06-12
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi
2026-06-12
digitimes.com
2026-06-12
Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related chips, and rising use of advanced packaging capacity. The result suggests continued momentum in global semiconductor supply chains, with implications for networking, memory, and high-performance computing markets worldwide.
2026-06-11
simplywall.st
2026-06-11
simplywall.st
United States/Semiconductors/NasdaqGS:ASML
Assessing ASML Holding (NasdaqGS:ASML) Valuation After Strong Recent Share Price Performance
June 11, 2026
Simply Wall St
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ASML Holding stock snapshot after recent performance
ASML Holding (NasdaqGS:ASML) has drawn fresh attention after a period of strong returns, with the stock up about 11% over the past month and about 28% over the past 3
2026-06-11
digitimes.com
2026-06-11
Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation server memory platforms.
2026-06-11
www.tomshardware.com
2026-06-11
Tom's Hardware
PC Components CPUs
AMD fires back at Nvidia, claiming 256-core Zen 6 'Venice' CPU beats Vera by 3.3x in rack-level performance — company shares first estimated EPYC Venice benchmarks
News
By Jake Roach published 4 hours ago
Mind the footnotes on this one.
(Image credit: AMD)
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2026-06-11
tomshardware.com
2026-06-11
Jake Roach
AMD has shared the first official results for its 256-core EPYC Venice CPU, saying it beats Nvidia's Vera by 3.3x in a rack-level deployment.
2026-06-10
digitimes.com
2026-06-10
WinWay Technologies said shipments linked to artificial intelligence, high-performance computing, central processing units, and application processors lifted consolidated revenue to NT$1.073 billion (US$33.9 million) in May 2026, the company's second-highest monthly total on record. For global readers tracking the semiconductor supply chain, the results signal how AI infrastructure demand is resha