Semiconductor News & Analysis Feed
423 articles
2026-06-24
www.marketscreener.com
2026-06-24
marketscreener.com
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2026-06-23
www.manilatimes.net
2026-06-23
The Manila Times
Production-ready 3DI technology supports more compact FEMs for advanced 5G devices
MALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, delivering advanced 3D integration (3DI) for compact, high-pe
2026-06-23
gf.com
2026-06-23
GlobalFoundries
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2026-06-23
www.moomoo.com
2026-06-23
Moomoo
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2026-06-23
finimize.com
2026-06-23
Finimize
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2026-06-23
digitimes.com
2026-06-23
Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of 24 tracked companies posting positive year-over-year gains, according to monthly revenue filings compiled for the period. The results underscore continued downstream demand driven by AI-related chip shipments and a broader recovery in consumer electronics.
2026-06-23
digitimes.com
2026-06-23
Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing applications in advanced packaging, optical transmission and third-generation semiconductors. The rollout covers simultaneous construction and capacity ramp projects at Erlin, Zhengzhou, and Zhunan to align production
2026-06-23
www.investing.com
2026-06-23
Investing.com
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2026-06-23
ca.investing.com
2026-06-23
Investing.com Canada
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2026-06-23
www.streetinsider.com
2026-06-23
StreetInsider
www.streetinsider.com
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2026-06-23
news.google.com
2026-06-23
Business Wire
2026-06-23
sg.finance.yahoo.com
2026-06-23
Yahoo Finance Singapore
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Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
Business Wire
Mon, 22 June 2026 at 1:30 pm GMT-7 2 min read
Q
-8.23%
Qnity’s material innovations enable next-generation advanced packaging, showcased through new Innovation Hub
WILMINGTON, Del., June 22, 2026--(BUSINE
2026-06-23
www.lincolnjournal.com
2026-06-23
lincolnjournal.com
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Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
Jun 22, 2026 Updated 1
2026-06-23
www.marketscreener.com
2026-06-23
marketscreener.com
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2026-06-23
wccftech.com
2026-06-23
Wccftech
SPHBM4 is a new JEDEC standard that aims to solve the high cost and packaging concerns with existing HBM technologies.
Almost all AI & HPC accelerators rolling out these days feature some form of HBM memory. The highest-end solutions are leveraging the latest HBM4 designs, and HBM4E is being sampled to the top chipmakers.
But as demand continues to rise, and shortages persist in the premium DRAM
2026-06-23
www.abc15.com
2026-06-23
ABC15 Arizona
NEWSBUSINESS
TSMC, Amkor lock in 10-year deal for advanced packaging and test services
You can watch the latest headlines and weather from ABC15 Arizona in Phoenix any time on-air, online, and on the ABC15 mobile and streaming apps.
By: Ethan Holtzinger, Phoenix Business Journal
Posted 1:08 AM, Jun 23, 2026
Two Valley semiconductor giants have formalized a long-planned partnership.
Taiwan Se
2026-06-22
blockonomi.com
2026-06-22
Blockonomi
blockonomi.com
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2026-06-22
www.tradingview.com
2026-06-22
TradingView
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LPK: Leadership in advanced packaging and LIDE technology drives growth amid ongoing restructuring
LPK: Leadership in advanced packaging and LIDE technology drives growth amid ongoing restructuring
Less than 1 min read
LPK
−6.05%
The conference highlighted leadership in laser-based advanced packaging, with LIDE technology driving defect-free glass structuring for next-gen chips. D
2026-06-22
www.digitimes.com
2026-06-22
digitimes
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies. The appointment also represents another strategic move by Intel CEO...
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2026-06-22
news.google.com
2026-06-22
Bits&Chips