Semiconductor News & Analysis Feed
20 articles
2026-09-14
2026-09-12
2026-09-02
finance.biggo.com
2026-09-02
Hanwha Semiconductor made its first appearance at SEMICON Taiwan 2026 with unveiling fan-out panel-level packaging (FOPLP) equipment based on 600×600mm square panels. This marks the company's strategic expansion beyond its core high-bandwidth memory (HBM) bonding equipment focus into next-generation
2026-08-28
2026-08-27
2026-08-26
2026-08-24
2026-08-20
www.digitimes.com
2026-08-20
2026-08-20
2026-08-19
2026-08-19
2026-07-31
2026-07-17
2026-06-18
www.digitimes.com
2026-06-18
The advancement of AI chip technology is driving semiconductor manufacturers to adopt FOPLP (Fan-Out Panel Level Packaging) over traditional FOWLP (Fan-Out Wafer Level Packaging) to improve manufacturing efficiency. As chip sizes increase and heterogeneous integration packaging becomes more prevalen
2026-06-18
2026-06-16
2026-06-15
www.digitimes.com
2026-06-15
Manz's successful delivery of the world's first 310mm x 310mm panel-level packaging electrochemical deposition (ECD) mass-production tool represents a significant advancement in semiconductor packaging technology. This breakthrough demonstrates the industry's shift toward larger panel sizes and more
2026-06-15
2026-06-13
2026-06-03
www.digitimes.com
2026-06-03
Naura Technology Group's launch of its first 600mm × 600mm panel-level packaging descum tool represents a significant breakthrough in China's semiconductor equipment manufacturing capabilities. This advancement marks the company's strategic shift from wafer-level to panel-level packaging, addressing