Semiconductor News & Analysis Feed
16 articles
2026-07-31
2026-07-17
2026-06-18
www.digitimes.com
2026-06-18
The advancement of AI chip technology is driving semiconductor manufacturers to adopt FOPLP (Fan-Out Panel Level Packaging) over traditional FOWLP (Fan-Out Wafer Level Packaging) to improve manufacturing efficiency. As chip sizes increase and heterogeneous integration packaging becomes more prevalen
2026-06-18
2026-06-16
2026-06-15
www.digitimes.com
2026-06-15
Manz's successful delivery of the world's first 310mm x 310mm panel-level packaging electrochemical deposition (ECD) mass-production tool represents a significant advancement in semiconductor packaging technology. This breakthrough demonstrates the industry's shift toward larger panel sizes and more
2026-06-15
2026-06-13
2026-06-03
www.digitimes.com
2026-06-03
Naura Technology Group's launch of its first 600mm × 600mm panel-level packaging descum tool represents a significant breakthrough in China's semiconductor equipment manufacturing capabilities. This advancement marks the company's strategic shift from wafer-level to panel-level packaging, addressing
2026-05-29
2026-05-28
2026-05-27
news.google.com
2026-05-27
2026-05-25
wccftech.com
2026-05-25
According to a report by the Taiwan Commercial Times, AMD’s next-generation x86 CPU architecture, Zen 7 (codename Grimlock), is expected to leverage TSMC’s A14 1.4nm process technology and advanced FOPLP packaging. The processor is anticipated to launch in 2028, underscoring AMD’s continued push int
2026-05-25
www.trendforce.com
2026-05-25
According to reports from Commercial Times and TweakTown, AMD’s next-generation Zen 7 processor is expected to be manufactured using TSMC’s A14 process node, with Powertech Technology’s fan-out panel-level packaging (FOPLP) under evaluation. This development underscores AMD’s pursuit of advanced man
2026-05-12
www.digitimes.com
2026-05-12
Innolux stock surged following reports of a potential partnership with TSMC in FOPLP technology. Unlike AUO, which remained in the red in Q1 2026, Innolux returned to profitability with NT$1.79 billion net income, while its competitor AUO continued to report losses. This performance improvement sign