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Hanwha Semiconductor made its first appearance at SEMICON Taiwan 2026 with unveiling fan-out panel-level packaging (FOPLP) equipment based on 600×600mm square panels. This marks the company's strategic expansion beyond its core high-bandwidth memory (HBM) bonding equipment focus into next-generation

Naura Technology Group's launch of its first 600mm × 600mm panel-level packaging descum tool represents a significant breakthrough in China's semiconductor equipment manufacturing capabilities. This advancement marks the company's strategic shift from wafer-level to panel-level packaging, addressing