PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips

The increasing integration of AI chips is driving packaging technology toward panel-level manufacturing, with FOPLP and CoPoS emerging as dominant approaches, signaling the decline of traditional 300mm wafer processes. This shift exerts new demands on upstream materials and equipment, particularly in glass substrates, wafer bonding, and high-density interconnects, accelerating supply chain restructuring. Geopolitical tensions, especially in export controls over critical materials and equipment, are forcing companies to reassess supply chain resilience. Competitors may accelerate capacity investments or pursue M&A to gain technological advantages. Over the next 12–24 months, packaging technology divergence will intensify, with FOPLP likely becoming the mainstream for AI chips, while CoPoS targets high-performance computing. Glass substrate technology may see breakthrough applications by 2026.