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2026-06-04
www.eenewseurope.com
2026-06-04
eeNews Europe
JEDEC has released two new guideline documents aimed at supporting the growing use of silicon carbide (SiC) power semiconductors in applications ranging from electric vehicles to industrial power systems. The publications, JEP203 and JEP204, were developed by the JC-70.2 Silicon Carbide Subcommittee and are available as free downloads from the JEDEC website.
2026-06-04
evertiq.com
2026-06-04
Evertiq
© GlobalFoundries
Business | June 04, 2026
GF completes acquisition of Synopsys' ARC processor IP business
Evertiq
GlobalFoundries has completed its previously announced acquisition of the ARC Processor IP Solutions business from Synopsys, combining it with its existing MIPS subsidiary to create what the company describes as a software-to-silicon capability built for physical AI applications.
The
2026-06-04
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2026-06-04
New Electronics
2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
MSN
Earnings Call Insights: Broadcom (AVGO) Q2 fiscal 2026
Management View
"In our fiscal Q2 2026, total revenue reached a record $22.2 billion, up 48% year-on-year, above our guidance on strength in AI semiconductors." (President, CEO & Executive Director Hock Tan)
"During the quarter, bookings for AI semiconductors were over $30 billion against the $10.8 billion we shipped." (President, CEO & Execu
2026-06-04
www.cnbc.com
2026-06-04
CNBC
Printed circuit boards sit underneath almost every chip, a necessity in nearly every electronic. They make up a quiet but crucial piece of the booming artificial intelligence market, and represent a growing problem for the U.S., because nearly all AI circuit boards, for Nvidia
and others, are made in China.
Circuit boards present all sorts of opportunities for adversaries to sneak through malici
2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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Artificial Intelligence
Nvidia Partnered With A Chinese Company To Build A 'Physical AI' Humanoid Robot
By Sead Fadilpasic June 3, 2026 12:17 pm EST
Nvidia
Nvidia has entered the humanoid robotics race. Through a partnership with Chinese startup Unitree, the U.S. chipmaker is developing a robotics system with an integrated reference design focused on academic research. The idea is to
2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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AP
JEDEC® Releases New SiC Guidelines to Improve Reliability and Evaluation in Power Electronics
Business Wire 9 hrs ago 0
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ARLINGTON, Va.--(BUSINESS WIRE)--Jun 3, 2026--
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announced the publication of JEP
2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
www.thelec.net
2026-06-03
thelec.net
Genesem says orders for HBM and advanced packaging equipment are becoming increasingly visible as the market expands. (Photo: THE ELEC)
Genesem said on Monday that orders for advanced packaging equipment are becoming increasingly visible as demand rises in the high-bandwidth memory (HBM) and advanced semiconductor packaging markets.
The company recently completed development of next-generation p