Semiconductor News & Analysis Feed
5178 articles
2026-06-04
www.moomoo.com
2026-06-04
Moomoo
消息面上，随着英伟达等AI芯片功耗飙升，传统硅基电源架构已触及物理极限。行业正加速向800V高压直流(HVDC)架构过渡，碳化硅成为AI服务器固态变压器及电源管理的必选材料。英飞凌、意法半导体等巨头明确表示，AI数据中心的部署导致多款功率器件出现严重供应短缺。
公开资料显示，天岳先进在8英寸碳化硅衬底领域占据全球领先份额，12英寸完成样品研发、送样、小批量试样供货。据悉，天岳先进的12英寸SiC衬底进入台积电供应链验证阶段，作为下一代CoWoS中介层备选方案开展送样测试。用作替代硅中介层以解决高性能GPU的散热瓶颈。
Tianyue Advanced Materials (02631.HK) rose nearly 7% in early trading. As of the time of writing, it was up 3.27% at HK$104.1, with a tr
2026-06-04
news.futunn.com
2026-06-04
富途牛牛
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2026-06-04
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2026-06-04
富途牛牛
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2026-06-04
markets.financialcontent.com
2026-06-04
FinancialContent
Mitsubishi Electric to Ship 5th-generation SiC-MOSFET Bare Die Samples
By:
Mitsubishi Electric Corporation
via
Business Wire
June 03, 2026 at 23:00 PM EDT
ⓘ This article is third-party content and does not represent the views of this site. We make no guarantees regarding its accuracy or completeness.
Industry-leading low on-resistance, approx. 25% less than existing products, enhances xEV power e
2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
www.digitimes.com
2026-06-04
digitimes
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing power and energy efficiency. The concept is increasingly seen as a key route...
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2026-06-04
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2026-06-04
Yahoo Finance
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2026-06-04
www.digitimes.com
2026-06-04
digitimes
At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a compound semiconductor material whose ability to handle high voltages and large...
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2026-06-04
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2026-06-04
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2026-06-04
www.aastocks.com
2026-06-04
AASTOCKS.com
SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) Chairman C.C. Wei. The two sides exchanged views on the development of next-generation AI technologies and agreed to further strengthen comprehensive cooperation, including joint research and development of next-generation high bandwidth memory (HBM) and advanced packaging technologies, in order t
2026-06-04
www.aastocks.com
2026-06-04
AASTOCKS.com
SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) -10.000 (-2.239%)
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-1.196%
Chairman C.C. Wei. The two sides exchanged views on the development of next-generation AI technologies and agreed to further strengthen comprehensive cooperation, including joint research and development of next-generation high bandwidth memory (HBM) and advanced p
2026-06-04
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2026-06-04
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SK Group, TSMC Agree to Strengthen Ties in HBM, Advanced Packaging
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SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufac
2026-06-04
www.aastocks.com
2026-06-04
AASTOCKS.com
SK Group Chairman Chey Tae-won met with Taiwan Semiconductor Manufacturing Company Ltd. (TSM.US) Chairman C.C. Wei. The two sides exchanged views on the development of next-generation AI technologies and agreed to further strengthen comprehensive cooperation, including joint research and development of next-generation high bandwidth memory (HBM) and advanced packaging technologies, in order t
2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
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2026-06-04
Investing.com
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