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SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV

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tomshardware.com 2026-07-21

Recent teardown analysis by SemiAnalysis of Huawei's Kirin 9030 chip revealed that SMIC's third-generation 7nm process (N+3) achieves a smaller metal pitch than Intel's 18A and surpasses TSMC's N6 in transistor density, despite not using EUV lithography. However, this does not make SMIC's N+3 proces

SMIC TSMC Intel Semiconductor Process 7nm Technology Metal Pitch Transistor Density EUV Lithography

SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV — analysis of N+3 shows significant advancement for Chinese semi manufacturing - Tom's Hardware

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www.tomshardware.com 2026-07-21

SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

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digitimes.com 2026-06-18

Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown lab

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tomshardware.com 2026-06-16

SMIC's third-generation 7nm process achieves a metal pitch of 32.5nm, surpassing Intel's 18A node at 36nm, but overall transistor density lags by 38%. This finding comes from SemiAnalysis's first teardown from its new in-house lab, analyzing the HiSilicon Kirin 9030 chip found in Huawei's Mate 80. D

SMIC Huawei Kirin 9030 Semiconductor Process 7nm Node Metal Pitch Intel 18A Chip Teardown

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