Semiconductor News & Analysis Feed
743 articles
2026-06-25
digitimes.com
2026-06-25
ADATA Technology is stepping up discussions in Thailand amid rising global demand for AI computing centers. Chairman Simon Chen's visit highlights how Southeast Asia could benefit from expanding AI infrastructure, supporting industrial policy, and strengthening regional cooperation. The company sees Thailand as a possible hub for future growth and technology investment.
2026-06-25
digitimes.com
2026-06-25
Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises worldwide. The collaboration aims to simplify AI deployment across the compute continuum while enabling faster, more flexible, and more scalable hybrid AI applications.
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-25
wccftech.com
2026-06-25
Wccftech
Qualcomm is unveiling its breakthrough for the AI data center market called HBC (High-Bandwidth Compute), to break the memory wall.
At its Investors Day 2026, Qualcomm unveiled HBC under its Dragonfly brand, an innovative technology that aims to offer a major boost in memory capacity and bandwidth. The HBC architecture deploys a purpose-built & near-memory solution that bonds compute with boosted
2026-06-25
wccftech.com
2026-06-25
Wccftech
Qualcomm is expanding its chip-design services to China as it is reportedly in early talks with ByteDance.
Custom-chip designs are picking up momentum across the tech industry, and a report by Reuters suggests that Qualcomm might be assisting ByteDance, a leading Chinese firm, with chip-design services.
Although the talks between Qualcomm and ByteDance are still early, if they succeed, then that
2026-06-25
tomshardware.com
2026-06-25
Luke James
PremiumChina's LineShine supercomputer has taken the top spot on the 67th TOP500 list, posting 2.198 exaflops on the High Performance Linpack benchmark.
2026-06-24
finance.yahoo.com
2026-06-24
Yahoo Finance
Micron Technology (MU) Gains from Insatiable Demand For Computing Power
Soumya Eswaran
Wed, June 24, 2026 at 5:20 AM PDT 3 min read
MU
-2.93%
^GSPC
-0.13%
CL=F
-3.85%
Trade MU on Coinbase
Trading disclosure
Burke Wealth Management, an investment management company, released its "Focused Growth Strategy" first-quarter 2026 investor letter. A copy of the letter can be downloaded here. The Fund retu
2026-06-24
www.hpcwire.com
2026-06-24
HPCwire
www.hpcwire.com
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2026-06-24
digitimes.com
2026-06-24
Cerebras Systems delivered 92% revenue growth in its first quarter as a public company, but management cautioned that its decision to rent back computing capacity from an existing customer (a move expected to cut cloud margins by 10 to 15 points) will pressure profitability over the next several quarters.
2026-06-24
digitimes.com
2026-06-24
China's LineShine supercomputer debuted at No. 1 on the June 2026 TOP500 list, announced at the ISC 2026 conference in Hamburg, becoming the first system to sustain more than two exaflops on the standard HPL benchmark using CPUs only. The result marks the first time since 2017 that a China-based system has led the TOP500 ranking, and reflects Beijing's effort to present a frontier computing system
2026-06-24
digitimes.com
2026-06-24
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.
2026-06-24
digitimes.com
2026-06-24
IBM is building a foundry to produce silicon wafers used in quantum-computing processors, seeking to become an indispensable part of the quantum economy under development. Called Anderon, the independent subsidiary is set to begin production this year, a decade after IBM began exploring applications of quantum computing.
2026-06-24
marklapedus.substack.com
2026-06-24
Semiecosystem
Quantum Computing Acquires NHanced Semiconductors
Quantum Computing Inc., a quantum optics and photonics company, has acquired NHanced Semiconductors, a U.S-based advanced packaging vendor
SEMIECOSYSTEM
JUN 24, 2026
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By Mark LaPedus
Quantum Computing Inc. (QCi), a quantum optics and photonics company, has acquired NHanced Semiconductors, a U.S-based advanced packaging vendor.
Under t
2026-06-24
www.taipeitimes.com
2026-06-24
Taipei Times
A cross-party delegation led by Legislative Speaker Han Kuo-yu (韓國瑜) on Monday visited contract chipmaker Taiwan Semiconductor Manufacturing Co’s (TSMC) campus in Arizona, the Legislative Yuan said yesterday.
The delegation met with TSMC Arizona CEO Ray Chuang (莊瑞萍) to discuss the chipmaker’s investment in Phoenix, the legislature said in a statement.
Han, Chuang and the TSMC subsidiary’s manage
2026-06-23
www.hpcwire.com
2026-06-23
HPCwire
www.hpcwire.com
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2026-06-23
www.thelec.net
2026-06-23
thelec.net
Jay Y. Lee inspects the C1 and C2 production lines at Samsung Electronics' Cheonan campus. (Photo: Samsung Electronics)
Jay Y. Lee, executive chairman of Samsung Electronics, inspected the company's high-bandwidth memory (HBM) production operations in Cheonan, South Korea, reviewing supply readiness for HBM4 products that have recently generated strong business momentum.
On June 23, Lee visited
2026-06-23
tomshardware.com
2026-06-23
Anton Shilov
China's LineShine supercomputer is now officially the world's fastest FP64 machine, but its mixed-precision results are behind those of El Capitan, Frontier, and Aurora.
2026-06-23
www.nextplatform.com
2026-06-23
The Next Platform
AMD And Nvidia Are Neck In HPC Supercomputing
Timothy Prickett Morgan
Co-Editor, Co-Founder, The Next Platform
Published Tue 23 Jun 2026 // 13:25 UTC
Necessity is always the mother of invention, and if you are trying to create an indigenous compute engine design and manufacturing capability, as China certainly is, then it stands to reason that the Middle Kingdom’s eight national computing centers
2026-06-23
www.storagenewsletter.com
2026-06-23
StorageNewsletter
SK hynix Receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM
Recognition highlights the company's achievements in driving expansion of AI computing through HBM innovation and application
This is a Press Release edited by StorageNewsletter.com on June 23, 2026 at 2:00 pm
SK hynix Inc. announced that it received the Corporate Innovation Award at the ‘2026 IEEE