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Intel has appointed former SK Hynix and SK On CEO Lee Seok-hee as a senior vice president in its foundry business, focusing on advanced packaging and system integration. This move underscores Intel's strategic emphasis on next-generation AI systems, where packaging plays a critical role. Lee brings

On June 20, 2026, Intel announced the appointment of Lee Seok-hee, former CEO of SK Hynix and SK On, as senior vice president in its foundry business, overseeing advanced packaging, system integration, backend technology development, and manufacturing. This move underscores Intel's strategic push to

Intel has appointed former SK hynix CEO Lee Seok-hee to lead its advanced packaging initiatives within the foundry business, marking a strategic move to strengthen its manufacturing capabilities. Reporting directly to CEO Lip-Bu Tan, Lee will oversee the scaling of advanced packaging technologies su

Intel has appointed former SK Hynix and SK On CEO Lee Seok-hee as a senior vice president in its foundry business, focusing on advanced packaging, system integration, and backend manufacturing. This move underscores Intel's strategic effort to rebuild its semiconductor manufacturing capabilities and

Intel's hiring of former SK Hynix executive Lee Seok-hee has sparked significant industry attention, generating hopes for a potential partnership between the two companies while raising concerns among competitors like Samsung. This strategic talent acquisition reflects Intel's broader efforts to str