Semiconductor News & Analysis Feed
1170 articles
2026-06-16
digitimes.com
2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics' foundry business is reportedly expanding its strategic relationship with companies led by Elon Musk, with cooperation now spanning electric vehicles and emerging neurotechnology, according to Hankyungreporting.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
techxplore.com
2026-06-16
Tech Xplore
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2026-06-16
news.google.com
2026-06-16
Stock Titan
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Applied Materials Unveils Deposition and Selective Etch Systems to Advance 3D Chip Scaling
Applied Materials, Inc.
Mon, June 15, 2026 at 1:05 PM PDT 5 min read
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Applied Materials, Inc.
New systems enable precision materials engineering in high-aspec
2026-06-16
www.globenewswire.com
2026-06-16
GlobeNewswire
New systems enable precision materials engineering in high-aspect-ratio 3D logic and memory chip structures
Centris™ Spectral™ SiN ALD leverages innovative microwave plasma technology to deliver uniform silicon nitride deposition in challenging 3D structures
Producer™ Selectra™ Mo Etch selectively removes molybdenum for wordline separation to enable 3D NAND scaling
The new systems are being used b
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
AI packaging push: how TSMC’s CoWoS advanced packaging is scaling for the next wave
15.06.2026 - 19:54:24 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging platform is at the center of the AI accelerator boom. Capacity for the 2.5D chip-on-wafer-on-substrate technology is ramping hard, with the foundry targeting well over 100,000 wafers per month as hyperscaler demand keeps clim
2026-06-15
simplywall.st
2026-06-15
simplywall.st
United States/Semiconductors/NasdaqGS:AMKR
Amkor Technology (AMKR) Is Up 21.2% After Outlining AI-Focused Advanced Packaging Expansion Strategy
June 15, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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Amkor Technology recently reported record Q1 2026 revenue and used its first Investor Day in nearly 20 years to outline ambitious long-term growth targets anchored in advanced packagi
2026-06-15
news.bloomberglaw.com
2026-06-15
Bloomberg Law News
President Donald Trump’s approval for Nvidia to sell chips to some customers in China has potentially derailed a major AI smuggling prosecution nearing trial after the judge ordered the Justice Department to disclose internal White House communications.
In an unusual decision, a Houston federal judge earlier in June directed federal prosecutors to provide the defense nonpublic presidential materi
2026-06-15
news.bgov.com
2026-06-15
Bloomberg Government News
President Donald Trump’s approval for Nvidia to sell chips to some customers in China has potentially derailed a major AI smuggling prosecution nearing trial after the judge ordered the Justice Department to disclose internal White House communications.
In an unusual decision, a Houston federal judge earlier in June directed federal prosecutors to provide the defense nonpublic presidential materi
2026-06-15
www.moomoo.com
2026-06-15
Moomoo
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2026-06-15
www.tomshardware.com
2026-06-15
Tom's Hardware
Tech Industry
China's supreme court bans Infineon from selling GaN power chips in China — market-leader Innoscience secures major victory in multi-region patent war
News
By Luke James published 37 minutes ago
Two suppliers building Nvidia's 800V AI-rack power chips now block each other from key markets.
(Image credit: Getty / Pla2na)
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2026-06-15
tomshardware.com
2026-06-15
Luke James
China's Supreme People's Court on Friday upheld an injunction prohibiting Infineon from selling disputed GaN products in mainland China.
2026-06-15
finance.yahoo.com
2026-06-15
Yahoo Finance
AI Memory Bottleneck: This Sizzling ETF Lets You Buy Micron, Sandisk, SK Hynix, and Samsung for Less Than $100
Harsh Chauhan, The Motley Fool
Mon, June 15, 2026 at 6:53 AM PDT 4 min read
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Memory has emerged as one of the biggest bottlenecks in the artificial intelligence (AI) infrastru
2026-06-15
tomshardware.com
2026-06-15
Mark Tyson
GoldenEye Recomp v1.0 has been released, providing 'a native PC port of GoldenEye 007 built by statically recompiling the original game into C++' with no emulation involved.
2026-06-15
www.fool.com
2026-06-15
The Motley Fool
Memory has emerged as one of the biggest bottlenecks in the artificial intelligence (AI) infrastructure space. Also known as the memory wall, this bottleneck occurs when the performance of an AI accelerator, such as a graphics processing unit (GPU), is constrained by slower memory.
As a result, companies designing AI accelerator chips have been turning to high-speed, high-bandwidth memory (HBM) c
2026-06-15
www.thelec.net
2026-06-15
thelec.net
SurplusGLOBAL headquarters in Yongin, South Korea. (Photo: THE ELEC)
SurplusGLOBAL said on June 15 that it has registered multiple patents in Korea related to semiconductor process equipment.
The newly registered patents include three technologies related to atomic layer deposition (ALD) equipment, wafer transfer, and wafer loading systems used in semiconductor manufacturing. SurplusGLOBAL plans
2026-06-15
news.google.com
2026-06-15
CNX Software
2026-06-15
smbtech.au
2026-06-15
SMBtech
HomeNewsD-Link Launches Three GaN Chargers In Australia And New Zealand With Up To 240W And Five Ports
D-Link Launches Three GaN Chargers In Australia And New Zealand With Up To 240W And Five Ports
Nick Ross June 15, 2026 News
D-Link has expanded its Tech Essentials range in Australia and New Zealand with three Gallium Nitride (GaN) chargers designed to replace multiple power adapters with a s