Semiconductor News & Analysis Feed
16 articles
2026-08-20
semiengineering.com
2026-08-20
As AI workloads demand higher bandwidth, manufacturers are increasingly adopting 2.5D and 3D packaging architectures to boost interconnect density. However, these advanced packaging techniques introduce new challenges, particularly in managing thermal expansion and electromigration. While 2.5D packa
2026-08-11
news.google.com
2026-08-11
2026-07-13
2026-07-11
www.thelec.net
2026-07-11
2026-07-07
www.tomshardware.com
2026-07-07
Intel has unveiled a new high-bandwidth memory (HBM) architecture through a patent filed in December 2024, aiming to address the packaging and cost bottlenecks associated with current interposer-based HBM solutions. The proposed Cross-Batch Memory (XBM) architecture shifts DRAM cells from the front-
2026-07-03
news.google.com
2026-07-03
2026-07-01
finance.biggo.com
2026-07-01
2026-06-12
www.eenewseurope.com
2026-06-12
Belgian research hub imec has made significant progress in chip integration technology, extending its 300mm RF silicon interposer platform to enable system-level integration of III-V chiplets with Si-CMOS technology. This advancement addresses emerging mmWave and sub-THz wireless applications, as we
2026-06-09
www.01net.it
2026-06-09
Qnity's introduction of enhanced advanced packaging materials for organic interposer applications represents a significant advancement in semiconductor packaging technology. This development addresses critical challenges in modern chip manufacturing, particularly in high-performance computing and AI
2026-06-09
www.marketscreener.com
2026-06-09
Qnity's introduction of enhanced advanced packaging materials for organic interposer applications represents a significant advancement in semiconductor packaging technology. As chip performance demands continue to rise, traditional packaging methods struggle to meet increasing integration requiremen
2026-06-09
news.google.com
2026-06-09
2026-06-09
finance.yahoo.com
2026-06-09
On June 8, 2026, Qnity Electronics announced the introduction of two enhanced advanced packaging materials designed for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. These materials are tailored to support advanced in
2026-06-09
www.mycarrollcountynews.com
2026-06-09
Qnity Electronics has introduced two enhanced advanced packaging materials for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. These innovations are designed to support advanced interconnect formation, redistribution la
2026-06-09
www.lincolnjournal.com
2026-06-09
Qnity Electronics has introduced enhanced advanced packaging materials tailored for organic interposer applications, including Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. These innovations are aimed at supporting advanced interconnect formation, re
2026-06-09
www.marketscreener.com
2026-06-09
Qnity Electronics has introduced enhanced advanced packaging material solutions for organic interposer applications, marking a significant development in semiconductor packaging technology. This advancement addresses critical challenges in modern chip manufacturing as processes scale down to advance
2026-05-06
www.digitimes.com
2026-05-06
Vanguard International Semiconductor (VIS) announced on May 5 that it has secured TSMC's support for establishing a new interposer fabrication line at its 12-inch facility in Singapore, marking VIS's strategic entry into the CoWoS supply chain. This partnership represents a significant move in the s