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Intel patent outlines embedding MicroLEDs directly into CPU package to light up wording or work as an 'extra asethic component'

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tomshardware.com 2026-09-29

Intel's recently published patent, filed in 2022, reveals a forward-looking approach to advanced packaging by embedding MicroLEDs directly into CPU packages using glass substrates and through-glass vias. While the stated purposes—ranging from aesthetic illumination of processor markings to operation

Intel MicroLED CPU Packaging Glass Substrate Through-Glass Via Advanced Packaging Nanowire Silicon Nitride

Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer

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tomshardware.com 2026-07-07

Intel has revealed a new high-bandwidth memory (HBM) architecture, called Cross-Batch Memory (XBM), in a patent filed in December 2024 and published in July 2026. XBM aims to overcome the high packaging costs and complexity associated with current interposer-based HBM by shifting DRAM cell fabricati

Semiconductor Memory High-Bandwidth Memory HBM Silicon Interposer Memory Architecture Intel Patent UCIe Interface BEOL Technology

Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck - Tom's Hardware

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www.tomshardware.com 2026-07-07

Intel has unveiled a new high-bandwidth memory (HBM) architecture through a patent filed in December 2024, aiming to address the packaging and cost bottlenecks associated with current interposer-based HBM solutions. The proposed Cross-Batch Memory (XBM) architecture shifts DRAM cells from the front-

Semiconductor Memory Technology HBM XBM Architecture UCIe Interface Backend Transistor AI Memory Bottleneck Chip Packaging

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