SemiPulse | AI-Powered Semiconductor Supply Chain Intelligence & Market Signals

Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer

0.92

tomshardware.com 2026-07-07

Intel has revealed a new high-bandwidth memory (HBM) architecture, called Cross-Batch Memory (XBM), in a patent filed in December 2024 and published in July 2026. XBM aims to overcome the high packaging costs and complexity associated with current interposer-based HBM by shifting DRAM cell fabricati

Semiconductor Memory High-Bandwidth Memory HBM Silicon Interposer Memory Architecture Intel Patent UCIe Interface BEOL Technology

Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck - Tom's Hardware

0.92

www.tomshardware.com 2026-07-07

Intel has unveiled a new high-bandwidth memory (HBM) architecture through a patent filed in December 2024, aiming to address the packaging and cost bottlenecks associated with current interposer-based HBM solutions. The proposed Cross-Batch Memory (XBM) architecture shifts DRAM cells from the front-

Semiconductor Memory Technology HBM XBM Architecture UCIe Interface Backend Transistor AI Memory Bottleneck Chip Packaging

Semiconductor News & Analysis Feed