www.odaily.news
2026-07-01
odaily.news
In a research note released on June 26, UBS provided a more detailed picture of the spreading demand within China's AI hardware chain: demand for AI infrastructure remains robust, and the pull factors now extend beyond GPUs to include PCBs, optical interconnects, liquid cooling, SiC substrates, and optical communication materials.
www.odaily.news
2026-07-01
odaily.news
In a research note released on June 26, UBS provided a more detailed picture of the spreading demand within China's AI hardware chain: demand for AI infrastructure remains robust, and the pull factors now extend beyond GPUs to include PCBs, optical interconnects, liquid cooling, SiC substrates, and optical communication materials.