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2026-06-04
Hanmi Semiconductor debuts at Computex, unveils HBM4 and 2.5D AI packaging gear - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-06-04 Chosunbiz
By  Lee Ho-jun Published 2026.06.04. 09:59 HANMI Semiconductor sets up a booth at the 2026 Computex exhibition. /Courtesy of HANMI Semiconductor HANMI Semiconductor took part in Taiwan's Computex for the first time and showcased High Bandwidth Memory (HBM) production equipment and next-generation packaging equipment. HANMI Semiconductor said on the 4th that it participated in "Computex 2026," he
Semiconductor EquipmentHBM42.5D PackagingComputexAI ChipsSilicon InterposerTSV TechnologyHigh Bandwidth Memory
2026-05-21
Hanmi Semiconductor to enter US market with California subsidiary - Manufacturing Dive
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www.manufacturingdive.com 2026-05-21 Manufacturing Dive
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2026-05-19
Hanmi Semiconductor Profit Plunges 88% as HBM Equipment Demand Slows - thelec.net
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www.thelec.net 2026-05-19 thelec.net
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2026-05-18
Hanmi Semiconductor Plans US Expansion to Capture Growing AI Chip Packaging Demand - CXO Digitalpulse
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www.cxodigitalpulse.com 2026-05-18 CXO Digitalpulse
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2026-05-15
Hanmi Semiconductor Sets Up U.S. Outpost for HBM Equipment Push - Seoul Economic Daily
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en.sedaily.com 2026-05-15 Seoul Economic Daily
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