Semiconductor News & Analysis Feed
23 articles
2026-07-20
www.tradingview.com
2026-07-20
TradingView
2026-07-20
www.digitimes.com
2026-07-20
digitimes
2026-07-16
digitimes.com
2026-07-16
Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically in high-bandwidth memory, or HBM.
2026-07-15
pulse.mk.co.kr
2026-07-15
매일경제
2026-07-15
mkbn.mk.co.kr
2026-07-15
mkbn.mk.co.kr
2026-07-15
finance.biggo.com
2026-07-15
finance.biggo.com
2026-07-14
news.google.com
2026-07-14
Chosunbiz
2026-07-08
digitimes.com
2026-07-08
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor supply chain. As ASE boosts capacity to meet TSMC-linked demand, Hanmi is positioning for broader sales growth in the second half of 2026 and beyond.
2026-06-30
biz.chosun.com
2026-06-30
Chosunbiz
By
Jeong Du-yong
Published 2026.06.30. 15:27
Image of HANMI Semiconductor's 2.5D TC Bonder 40 equipment./Courtesy of HANMI Semiconductor
HANMI Semiconductor said on the 30th it will launch a new tool, "2.5D TC Bonder 40," which supports the 2.5-dimensional (D) packaging process for AI semiconductors. The company plans to supply equipment to global foundries and outsourced semiconductor assembly
2026-06-27
digitimes.com
2026-06-27
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.
2026-06-26
en.sedaily.com
2026-06-26
Seoul Economic Daily
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2026-06-26
en.sedaily.com
2026-06-26
Seoul Economic Daily
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2026-06-26
biz.chosun.com
2026-06-26
Chosunbiz
By
Jeong Du-yong
Published 2026.06.26. 10:39
Product image of the new FC Bonder 3.5 for artificial intelligence (AI) system semiconductors from ##HANMI Semiconductor##./Courtesy of ##HANMI Semiconductor##
HANMI Semiconductor said on the 26th it launched new equipment for artificial intelligence (AI) system semiconductors, the "FC Bonder 3.5" (Flip Chip Bonder 3.5). The company plans to supply th
2026-06-13
news.google.com
2026-06-13
upi.com
2026-06-12
news.google.com
2026-06-12
KED Global
2026-06-12
news.google.com
2026-06-12
The Korea Herald
2026-06-12
digitimes.com
2026-06-12
Hanmi Semiconductor plans to invest KRW50 billion (US$32.81 million) in SpaceX, highlighting how space, satellites, and artificial intelligence infrastructure are increasingly linked. For global readers, the deal signals how semiconductor suppliers are positioning themselves around next-generation supply chains, customer demand, and the expansion of AI-driven industrial ecosystems.
2026-06-09
digitimes.com
2026-06-09
SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand strains supplies of advanced memory chips.
2026-06-04
biz.chosun.com
2026-06-04
Chosunbiz
By
Lee Ho-jun
Published 2026.06.04. 09:59
HANMI Semiconductor sets up a booth at the 2026 Computex exhibition. /Courtesy of HANMI Semiconductor
HANMI Semiconductor took part in Taiwan's Computex for the first time and showcased High Bandwidth Memory (HBM) production equipment and next-generation packaging equipment.
HANMI Semiconductor said on the 4th that it participated in "Computex 2026," he
2026-05-21
www.manufacturingdive.com
2026-05-21
Manufacturing Dive
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