Semiconductor News & Analysis Feed

738 articles
2026-06-04
tynmagazine.com 2026-06-04 TyN Magazine
tynmagazine.com Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a06420de0cacb6a2 Performance and Security by Cloudflare Privacy
2026-06-04
wccftech.com 2026-06-04 Wccftech
While China develops workarounds to US sanctions of high-end extreme ultraviolet (EUV) machines, the shortage in the memory industry due to high demand from AI chips has created an opportunity for Chinese firms to gain market share, suggests a report from the Korean media. The aggressive approach, led by the Chinese government, has narrowed down the gap between China and Korea for HBM memory to th
2026-06-04
www.techtimes.com 2026-06-04 Tech Times
By Kyle Belmonte Published: Jun 03 2026, 12:57 PM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket A visitor takes a picture of a model of SK hynix's high-bandwidth memory (HBM) technology during the 2025 World IT Show in Seoul on April 24, 2025. South Korean chip giant SK hynix reported record quarterly profits on April 24, thanks to soa
2026-06-04
www.msn.com 2026-06-04 MSN
__fail__
2026-06-03
tomshardware.com 2026-06-03 Luke James
Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.
2026-06-03
www.thelec.net 2026-06-03 thelec.net
Genesem says orders for HBM and advanced packaging equipment are becoming increasingly visible as the market expands. (Photo: THE ELEC) Genesem said on Monday that orders for advanced packaging equipment are becoming increasingly visible as demand rises in the high-bandwidth memory (HBM) and advanced semiconductor packaging markets. The company recently completed development of next-generation p
2026-06-03
www.ideal-investisseur.fr 2026-06-03 Idéal Investisseur
Air Liquide Signs Major Contract with SK hynix to Support HBM Chip Production in Korea On Wednesday, the French group announced the construction of a dedicated nitrogen production unit for SK hynix's HBM memory chip packaging plant in Cheongju. This long-term major contract represents the first major integration project following the acquisition of DIG Airgas earlier this year. PUBLISHED ON JUN
2026-06-03
www.upi.com 2026-06-03 upi.com
June 2 (Asia Today) -- Nvidia CEO Jensen Huang visited the SK hynix booth at Computex 2026 in Taipei on Tuesday, meeting SK Group Chairman Chey Tae-won for a second straight day as the companies deepen their artificial intelligence partnership. Huang, who met privately with Chey on Monday, examined SK hynix's major memory products and wrote "Please Make More" on an HBM4E wafer displayed at the bo
2026-06-03
en.sedaily.com 2026-06-03 Seoul Economic Daily
403 ERROR The request could not be satisfied. Request blocked. We can't connect to the server for this app or website at this time. There might be too much traffic or a configuration error. Try again later, or contact the app or website owner. If you provide content to customers through CloudFront, you can find steps to troubleshoot and help prevent this error by reviewing the CloudFront documenta
2026-06-03
en.sedaily.com 2026-06-03 Seoul Economic Daily
Jensen Huang to SK hynix: "Please Make More HBM" Day 1 of Computex 2026 in Taipei, Taiwan Jensen Huang Visits SK hynix Booth SK hynix Unveils HBM4E Wafer Sample for First Time CEO Huang Signs HBM4E Wafer Leaves Special Request: "Please Make More HBM" Finance | Published 2026.06.03. 07:00:05 | By Lee Suk-jin in Taipei | Summary | Save A A A Nvidia CEO Jensen Huang shakes hands with SK Group Chair
2026-06-03
en.sedaily.com 2026-06-03 Seoul Economic Daily
Jensen Huang to SK hynix: "Please Make More HBM" Day 1 of Computex 2026 in Taipei, Taiwan Jensen Huang Visits SK hynix Booth SK hynix Unveils HBM4E Wafer Sample for First Time CEO Huang Signs HBM4E Wafer Leaves Special Request: "Please Make More HBM" Property | Published 2026.06.03. 07:00:05 | By Lee Suk-jin in Taipei | Summary | Save A A A Nvidia CEO Jensen Huang shakes hands with SK Group Chai
2026-06-03
www.ad-hoc-news.de 2026-06-03 AD HOC NEWS
__fail__
2026-06-03
etfdb.com 2026-06-03 ETF Database
etfdb.com Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a05c87920944d406 Performance and Security by Cloudflare Privacy
2026-06-02
wccftech.com 2026-06-02 Wccftech
wccftech.com Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a05c92385a659142 Performance and Security by Cloudflare Privacy
2026-06-02
www.techtimes.com 2026-06-02 Tech Times
By Adrian Parham Published: Jun 02 2026, 10:00 AM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket Intel CEO Lip-Bu Tan delivers the Intel keynote at Computex 2026 in Taipei, Taiwan INTEL CORPORATION Intel CEO Lip-Bu Tan used Tuesday's Computex 2026 keynote in Taipei to deliver the most detailed public accounting yet of Crescent Island,
2026-06-02
www.theglobeandmail.com 2026-06-02 The Globe and Mail
A High-Conviction, Actively Managed ETF Built Around the Memory Semiconductor Ecosystem - the Critical Bottleneck Powering Artificial Intelligence, High-Performance Computing, and Data Center Infrastructure Tuttle Capital Management announces the launch of the Tuttle Capital Concentrated Memory Stack ETF (HBMX), a thematic, actively managed ETF designed to provide focused exposure to companies op
2026-06-02
www.ad-hoc-news.de 2026-06-02 AD HOC NEWS
__fail__
2026-06-02
grafa.com 2026-06-02 grafa.com
Tech Image for illustrative purposes only. Not a real photo. Camtek secures $105M in AI semiconductor equipment orders Written by Mahathir Bayena Published Jun. 2 2026 DISCOVER MORE United States News Share Camtek (NASDAQ:CAMT) announced it has received more than $105 million in new multi-system orders for its semiconductor inspection and metrology equipment, extending the company’s business visi
2026-06-02
www.ad-hoc-news.de 2026-06-02 AD HOC NEWS
__fail__
2026-06-02
www.asiae.co.kr 2026-06-02 아시아경제
__fail__