Report: China Closes HBM Gap With Korea To Just Three Years As CXMT Hits Technology Parity On HBM3 - Wccftech

According to a report from Korean media, while China develops workarounds to US sanctions on high-end extreme ultraviolet (EUV) machines, the memory industry shortage due to high demand from AI chips ... Read original →

CXMT’s HBM3 parity with Korean rivals isn’t just a three-year gap closure—it signals China’s successful circumvention of EUV sanctions via advanced packaging and mature-node optimization. This forces upstream equipment makers to accelerate non-EUV high-precision multi-patterning solutions and compels NVIDIA to diversify its HBM supply chain. Washington may respond by tightening export controls on advanced packaging tools, raising CXMT’s compliance costs. Samsung and SK Hynix are likely to counter with aggressive pricing and patent walls. Within 12–24 months, if CXMT secures IPO funding and anchors domestic AI chip clients like Huawei Ascend, the HBM market will shift from duopoly to tripolar, eroding TSMC’s CoWoS leverage and accelerating regional fragmentation of the global semiconductor supply chain.