Semiconductor News & Analysis Feed

Global markets are likely to feel the effects of a renewed rise in memory prices, as tighter supply and early inventory buying lift DRAM and NAND prices again in mid-June 2026. The trend could ripple through smartphones, PCs, and servers, while Apple's possible sourcing shifts may influence pricing across the wider semiconductor industry.

Chinese semiconductor material manufacturers are accelerating investments in advanced products as Beijing pushes for greater self-sufficiency, challenging the long-standing dominance of Japanese suppliers in a global market valued at US$73.2 billion.

Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening unified pod) cleaning equipment and expand its reach into global markets. The two companies held a signing ceremony on June 30, 2026.

By Yoo Jane Published 2026.06.27. 10:23 Updated 2026.06.29. 09:21 On the 26th in the afternoon, the closing price and SK Hynix stock price are displayed in the dealing room of Hana Bank's main branch in Jung-gu, Seoul. /News1 The KOSPI has emerged as a key variable in global stock markets, including the U.S. and Japan. Amid an AI investment boom, Samsung Electronics and SK Hynix have solidified

CXMT's IPO highlights the growing geopolitical fragmentation of the global semiconductor industry, strengthening China's ability to finance domestic DRAM expansion and reduce reliance on foreign capital and technology. As supply chains increasingly split along regional lines, the listing reinforces Beijing's push for memory self-sufficiency and reshapes competitive dynamics in global markets.

Optical lens manufacturer Calin Technology stated at its shareholders' meeting on June 24 that global market growth has been weakened by economic volatility and US tariff policies. It reported consolidated revenue of NT$1.02 billion (approx. US$32 million) in 2025 and a net loss after tax of NT$261 million. Although profitability fell short of expectations due to production volumes remaining below

The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.

Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) American depositary receipts (ADRs) rose over 4 percent in the US overnight, but its spot in the global market capitalization rankings fell one notch to No. 7, according to data released by companiesmarketcap. The data showed shares in aerospace firm Space Exploration Technologies Corp (SpaceX) jumped almost 20 percent to overtake TSMC for sixth

Global hardware growth is facing an increasingly fragile and fragmented supply chain. At PCIM Europe 2026, software intelligence firm Luminovo's OEM Growth Lead, Inga Schwarz, made a compelling case for why AI is no longer enough to save hardware companies from costly operational challenges. The industry, she argued, must embrace a transition toward deep, native domain enterprise integration to bu

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