Semiconductor News & Analysis Feed
20 articles
2026-08-06
2026-08-06
2026-08-03
www.tomshardware.com
2026-08-03
2026-08-02
finance.yahoo.com
2026-08-02
2026-07-31
www.tradingview.com
2026-07-31
The U.S. Department of Commerce has announced $8.74 billion in incentives under the CHIPS and Science Act to seven companies advancing semiconductor technologies for AI and high-performance computing. The initiative aims to strengthen U.S. leadership in advanced computing by reinforcing domestic sup
2026-07-31
www.benzinga.com
2026-07-31
The Trump administration unveiled an $874 million CHIPS Act AI initiative, demonstrating significant government commitment to strengthening U.S. semiconductor and AI competitiveness. This strategic investment focuses on advanced chip manufacturing technologies and supply chain reinforcement, with Gl
2026-07-30
2026-07-30
www.bizjournals.com
2026-07-30
2026-07-29
2026-07-29
finance.yahoo.com
2026-07-29
2026-07-14
eetimes.com
2026-07-14
At the MIPS event in Taipei, EE Times interviewed Sudipto Bose, Vice President of FDSOl product line at GlobalFoundries. The discussion centered on the rise of Physical AI and Agentic AI at the edge. Bose emphasized that Physical AI represents Agentic AI deployed at the edge, highlighting the shift
2026-07-09
gf.com
2026-07-09
GlobalFoundries has achieved significant progress in gallium nitride (GaN) technology adoption through end-to-end design and validation process optimization, substantially accelerating GaN commercialization. GaN, as a wide bandgap semiconductor material, demonstrates tremendous potential in RF power
2026-07-09
finance.yahoo.com
2026-07-09
On July 9, 2026, Micron Technology announced a potential investment of up to $3 billion to strengthen the U.S. semiconductor supply chain, which directly boosted GlobalFoundries (GFS) stock by 6%. As part of the initiative, Micron will provide $500 million in strategic financing to GlobalWafers to s
2026-07-09
www.investing.com
2026-07-09
2026-06-26
digitimes.com
2026-06-26
GlobalFoundries is positioning its Singapore operations as a core hub for the emerging physical AI era, reflecting the semiconductor industry's shift toward advanced AI hardware technologies. The company's expansion strategy targets the growing demand for AI chips in robotics, autonomous systems, an
2026-06-24
www.marketscreener.com
2026-06-24
GlobalFoundries has successfully validated its SLATE advanced packaging technology on the 9SW platform, marking a significant advancement for next-generation RF applications. This validation demonstrates GlobalFoundries' technical capabilities in advanced packaging and strengthens its competitive po
2026-06-23
www.manilatimes.net
2026-06-23
GlobalFoundries has announced that its SLATE™ wafer-to-wafer bonding technology is now production-ready on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, enabling compact and high-performance front-end modules (FEMs) for next-generation 5G devices. Manufactured at i
2026-06-23
gf.com
2026-06-23
GlobalFoundries announces advanced packaging technology adoption on its 9SW platform for next-generation radio frequency applications, marking a significant advancement in semiconductor manufacturing. The 9SW platform's integration of advanced packaging techniques enables substantial performance and
2026-06-23
news.google.com
2026-06-23
2026-06-23
eetimes.com
2026-06-23
GlobalFoundries and Qualinx have demonstrated a significant step toward European semiconductor sovereignty by completing the first fully European, end-to-end chip manufacturing flow at GlobalFoundries’ Dresden fab. The Qualinx QLX3xx GNSS SoC, built on GlobalFoundries’ FDX technology, targets secure