Semiconductor News & Analysis Feed

173 articles
2026-06-05
autonews.gasgoo.com 2026-06-05 Gasgoo
Home / News / Focusing on Central Computing, Zhuoyu and Qualcomm Deepen Strategic Partnership Qualcomm Focusing on Central Computing, Zhuoyu and Qualcomm Deepen Strategic Partnership Edited by Betty From Gasgoo | June 5 , 2026 19:45 BJT f SHARE TWEET in SHARE SHARE Gasgoo Munich- On June 4, Zhuoyu Technology and Qualcomm unveiled a next-generation domain controller for cockpit-driving fusion, bui
2026-06-05
autonews.gasgoo.com 2026-06-05 Gasgoo
Home / ICV / NIO, GigaDevice forge strategic alliance to advance automotive chip development NIO NIO, GigaDevice forge strategic alliance to advance automotive chip development Monika From Gasgoo | June 5 , 2026 19:38 BJT f SHARE TWEET in SHARE SHARE Gasgoo Munich- Chinese semiconductor supplier GigaDevice and electric vehicle maker NIO have entered into a strategic partnership aimed at strengthe
2026-06-05
www.reuters.com 2026-06-05 Reuters
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2026-06-05
finance.yahoo.com 2026-06-05 Yahoo Finance
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2026-06-04
finance.yahoo.com 2026-06-04 Yahoo Finance
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2026-06-04
iconnect007.com 2026-06-04 I-Connect007
Global Electronics Association Commends the European Commission for Strengthening Technological Sovereignty by Proposing the Chips Act 2.0 June 4, 2026 | Global Electronics Association Estimated reading time: 2 minutes The Global Electronics Association applauds the European Commission on releasing the Chips Act 2.0 as a critical part of the Technological Sovereignty Package. This proposal marks
2026-06-04
www.tradingview.com 2026-06-04 TradingView
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2026-06-03
finance.yahoo.com 2026-06-03 Yahoo Finance
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2026-06-03
www.ad-hoc-news.de 2026-06-03 AD HOC NEWS
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2026-06-02
www.ad-hoc-news.de 2026-06-02 AD HOC NEWS
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2026-06-02
ymcinema.com 2026-06-02 Y.M.Cinema
ymcinema.com Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a05c39255fd9f46e Performance and Security by Cloudflare Privacy
2026-06-02
www.ad-hoc-news.de 2026-06-02 AD HOC NEWS
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2026-05-31
www.thelec.net 2026-05-31 thelec.net
Hong Hao, newly appointed strategic advisor at BOS Semiconductors. (Photo: Hong Hao's LinkedIn) BOS Semiconductors said on May 29 that it has appointed Hong Hao, former corporate vice president at Intel Foundry, as a strategic advisor. The company said Hong is expected to contribute to next-generation artificial intelligence (AI) semiconductor strategies and the expansion of its global customer
2026-05-30
digitimes.com 2026-05-30
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment spending, and strategic-partner orders may support growth in 2026, even as it continues a gradual shift in its product mix and packaging portfolio.
2026-05-29
news.google.com 2026-05-29 KED Global
2026-05-29
www.devdiscourse.com 2026-05-29 Devdiscourse
Huawei's LogicFolding Revolution: Breaking Through Chip Design Barriers Huawei's innovative chip design principle, focusing on signal speed rather than shrinking semiconductors, introduces a new path for China amidst U.S. sanctions. Their approach, known as the Tau Scaling Law, seeks to enhance chip efficiency via tightly connected structures, although its true impact remains debated within the in
2026-05-29
digitimes.com 2026-05-29
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.
2026-05-29
digitimes.com 2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com 2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
finance.yahoo.com 2026-05-29 Yahoo Finance
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