wccftech.com
2026-05-25
According to a report by the Taiwan Commercial Times, AMD’s next-generation x86 CPU architecture, Zen 7 (codename Grimlock), is expected to leverage TSMC’s A14 1.4nm process technology and advanced FOPLP packaging. The processor is anticipated to launch in 2028, underscoring AMD’s continued push int
www.trendforce.com
2026-05-25
According to reports from Commercial Times and TweakTown, AMD’s next-generation Zen 7 processor is expected to be manufactured using TSMC’s A14 process node, with Powertech Technology’s fan-out panel-level packaging (FOPLP) under evaluation. This development underscores AMD’s pursuit of advanced man