Semiconductor News & Analysis Feed
93 articles
2026-06-30
digitimes.com
2026-06-30
AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.
2026-06-30
digitimes.com
2026-06-30
The 2026 peak season for IC design firms remains unclear, with global readers likely to feel the effects through pricier smartphones, PCs, and other devices. Supply-chain costs are rising, demand is hard to gauge, and companies are preparing for customer stockpiling that could keep chip orders elevated into the third quarter.
2026-06-30
tomshardware.com
2026-06-30
Zhiye Liu
Newegg has started selling G.Skill’s Trident Z5 NeoX memory kits featuring AMD ULL technology, and the prices are already high.
2026-06-27
digitimes.com
2026-06-27
A US$250 million award for I-Pulse's semiconductor and pulsed power research could have implications far beyond the US, potentially affecting energy, mining, defense, and chip supply chains used by industries worldwide. The funding is aimed at domestic capacity, but the technologies being developed may shape global competition and access.
2026-06-27
digitimes.com
2026-06-27
Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could have a lifecycle of only about two years.
2026-06-27
centralcurrent.org
2026-06-27
Central Current
Micron and town of Clay officials have agreed to a host community agreement that would require Micron to pay the town $30 million instead of the building permit fees it would have spent to build its first chip fabrication plant, town officials said Thursday night.
Building the first fab would have cost Micron $62 million in building permit fees, town officials said.
Town officials made the agr
2026-06-26
digitimes.com
2026-06-26
China's power semiconductor makers are lifting prices again as demand from artificial intelligence (AI) servers and new energy vehicles strengthens. The moves may signal a broader industry upcycle with global implications, as higher costs and tighter capacity could affect data centers, automotive suppliers, and power equipment buyers worldwide.
2026-06-25
digitimes.com
2026-06-25
Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises worldwide. The collaboration aims to simplify AI deployment across the compute continuum while enabling faster, more flexible, and more scalable hybrid AI applications.
2026-06-25
digitimes.com
2026-06-25
Rising demand for AI server builds is tightening the global supply of high-end MLCCs, driving steep price increases in China's electronics distribution market and exposing how quickly infrastructure demand can affect component costs worldwide. The rally underscores a structural mismatch that could keep pressure on buyers across technology supply chains for years, according to industry sources.
2026-06-23
tomshardware.com
2026-06-23
Bruno Ferreira
LG's large OLED panels get Intertek certification for "perfect" color and brightness, showing a clear picture even with extreme ambient light.
2026-06-23
www.tradingview.com
2026-06-23
TradingView
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TradingView
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Key facts: SK hynix HBM shortage; MSCI ruling may affect GDR; Large Hyperliquid shorts
Key facts: SK hynix HBM shortage; MSCI ruling may affect GDR; Large Hyperliquid shorts
Less than 1 min read
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SK hynix: strong AI data-center demand fuels HBM supply tightness; wafer capacity focused on HBM. Shortages in HBM3E and HBM4; general DRAM supply tighter and unit prices
2026-06-23
digitimes.com
2026-06-23
Industrial gas manufacturer Nippon Sanso Holdings announced it will raise prices for all helium products in the Japanese market starting in July 2026, with an average price increase of more than 30%. Affected products include helium used in key applications such as semiconductor front-end process wafer cooling and medical magnetic resonance imaging (MRI) equipment. The move is mainly driven by geo
2026-06-23
digitimes.com
2026-06-23
Infineon and InnoScience are escalating their global GaN patent dispute across the US, Germany, and China, with each side scoring wins in infringement suits that are already affecting real-world sales. Sources familiar with the matter say the latest rulings are effectively pushing the two companies into separate market territories.
2026-06-22
digitimes.com
2026-06-22
High-speed transmission IC design company ASMedia Technology held its annual shareholders meeting on June 17, completing a full board reshuffle. ASMedia president Che-Wei Lin stated that 2025 revenue surpassed NT$10 billion (approx. US$316.5 million) for the first time, while earnings per share (EPS) reached NT$72.7. However, amid structural changes in the industry driven by the continued expansio
2026-06-21
tomshardware.com
2026-06-21
Hassam Nasir
Turns out, an ice machine can cool a GPU perfectly fine as long as you're willing to modify it to the extreme and are patient enough to deal with the leaks.
2026-06-21
www.asiae.co.kr
2026-06-21
아시아경제
KERI Becomes First in the World to Identify Trapezoidal Defect Structure in SiC Power Semiconductors
Revealing the Cause of Yield Loss... Laying the Foundation for Mass Production of High-Quality Wafers
The identity of a representative "killer defect" that lowers the yield of silicon carbide (SiC) power semiconductors—key components in artificial intelligence (AI) data centers and electric vehicl
2026-06-20
www.phonearena.com
2026-06-20
PhoneArena
www.phonearena.com
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2026-06-19
news.google.com
2026-06-19
MarTech Cube
2026-06-19
digitimes.com
2026-06-19
India's air-conditioner supply chain may be becoming an early test case for a broader electronics manufacturing challenge: how to trace products, components, process data, and defects across high-volume production networks.
2026-06-18
digitimes.com
2026-06-18
Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a step toward moving atomically thin channel materials from laboratory devices closer to semiconductor manufacturing.