Semiconductor News & Analysis Feed
290 articles
2026-05-29
kfgo.com
2026-05-29
KFGO
By Foo Yun Chee
BRUSSELS, May 28 (Reuters) – The European Commission wants governments to buy chips made by EU startups as it seeks to reduce Europe’s reliance on U.S. and East Asian products, a document seen by Reuters shows.
The proposal, dubbed Chips Act 2.0, supplements the original Chips Act implemented three years ago, which has so far failed to achieve its goals to attract advanced ma
2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-28
seekingalpha.com
2026-05-28
Seeking Alpha
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2026-05-28
www.eenewseurope.com
2026-05-28
eeNews Europe
Toshiba has started test-sample shipments of a 1200V trench-gate SiC MOSFET aimed at power supply systems in AI data centres. The TW007D120E is housed in a QDPAK top-side cooled package and is designed to support higher current capability, improved thermal performance and higher power density in the power stage.
2026-05-28
www.tradingview.com
2026-05-28
TradingView
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2026-05-28
www.indexbox.io
2026-05-28
IndexBox
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2026-05-28
eetimes.com
2026-05-28
“Can Europe realistically compete on leading-edge fabs alone?” Maria Marced said. “No.”
2026-05-28
news.google.com
2026-05-28
EE Times
2026-05-28
digitimes.com
2026-05-28
Synopsys reported divergent regional performance in the second quarter, with China showing sequential growth while North America and Europe declined, as demand patterns for semiconductor design tools and simulation software remained uneven across end markets.
2026-05-28
digitimes.com
2026-05-28
During the 2026 Europe Day Dinner, Taiwanese President Ching-te Lai referenced how coal and steel formed the foundation of peace in Europe, comparing that to how semiconductors and AI shape global prosperity and democratic security for Taiwan. He said Taiwan's semiconductor ecosystem integrates critical technologies from leading European companies, praising the nature of like-minded partners worki
2026-05-27
www.xtb.com
2026-05-27
XTB.com
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Sentiment in the U.S. remains strong, with Nasdaq 100 (US100) futures climbing nearly 0.7% ahe
2026-05-27
www.xtb.com
2026-05-27
XTB.com
CFDs are complex instruments and come with a high risk of losing money rapidly due to leverage. 75% of retail investor accounts lose money when trading CFDs with this provider. You should consider whether you understand how CFDs work and whether you can afford to take the high risk of losing your money. Options are complex financial instruments and come with a high risk of losing the entire premiu
2026-05-27
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2026-05-27
TradingView
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2026-05-27
www.eenewseurope.com
2026-05-27
eeNews Europe
Infineon has expanded its CoolGaN BDS 40 V G3 bidirectional switch family with two devices for compact portable power designs. The IGK048B041S and IGK120B041S are intended for smartphones, notebooks and wearables, where board space and power-path efficiency remain tight design constraints.
For eeNews Europe readers, the update is relevant because it shows how GaN is moving further into low-voltag
2026-05-27
www.eletimes.ai
2026-05-27
ELE Times
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HomeElectronicsInfineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and...
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Infineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and Electromobility at PCIM Europe 2026
ELE Times News
May 27, 2026
PCIM 2026
At PCIM Europe 2026 in Nuremberg
2026-05-27
www.eqs-news.com
2026-05-27
EQS News
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2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 Deutschland - English
VOM NACHRICHTENDIENST
USI
27 Mai, 2026, 05:00 GMT
ARTIKEL TEILEN
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor pa
2026-05-27
www.thailand-business-news.com
2026-05-27
Thailand Business News
www.thailand-business-news.com
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
NEWS PROVIDED BY
USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging