Semiconductor News & Analysis Feed
2690 articles
2026-06-16
www.benzinga.com
2026-06-16
Benzinga
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2026-06-16
www.benzinga.com
2026-06-16
Benzinga
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2026-06-16
news.google.com
2026-06-16
CNBC
2026-06-16
evertiq.com
2026-06-16
Evertiq
© Omdia
Analysis | June 16, 2026
Semiconductor market hits record quarter, driven by memory surge
Evertiq
Semiconductor revenue grew 27% QoQ in Q1 2026 to reach USD 319 billion – the highest quarterly growth Omdia has recorded since it began tracking the market in 2002. It marks the third consecutive quarter of double-digit growth, putting the market on track to surpass USD 700 billion in the firs
2026-06-16
seekingalpha.com
2026-06-16
Seeking Alpha
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2026-06-16
www.cnbc.com
2026-06-16
CNBC
Qualcomm
is working on over 40 designs of new AI devices, CEO Cristiano Amon told CNBC, as the chip designer prepares for a wave of “agents” across consumer electronics.
In a wide-ranging interview on CNBC’s “The Tech Download” podcast, Amon laid out his views on the changing role of smartphones and apps, why smart glasses could be the next major consumer device, new types of electronics that wi
2026-06-16
www.cnbc.com
2026-06-16
CNBC
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2026-06-16
evertiq.com
2026-06-16
Evertiq
© Air Liquide
Electronics Production | June 16, 2026
Air Liquide invests €200M in Korea to back SK hynix’s AI chip project
Evertiq
In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit.
France’s Air Liquide has signed a long-term contract with SK hynix.
2026-06-16
www.tradingkey.com
2026-06-16
TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
www.channelnewsasia.com
2026-06-16
CNA
Singapore
PUB channels S$12 million to develop water efficiency solutions for wafer fabrication, data centres: DPM Gan
The data centre and chipmaking industries are water-intensive and provide critical components and services for artificial intelligence.
A file photo of an employee walking through a data centre. (Photo: REUTERS/Priyanshu Singh)
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2026-06-16
ourworldindata.org
2026-06-16
Our World in Data
Spending on the hardware that trains and runs artificial intelligence has grown rapidly over the past years. One of the clearest indicators of how rapidly spending has increased is the revenue of American chipmaker NVIDIA.
The company accounts for around 85% of the global market for AI chips. These are graphics processing units (GPUs), originally built for video games but well-suited to the paral
2026-06-16
digitimes.com
2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-16
digitimes.com
2026-06-16
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity for the second half of the year. But supply chain players say the long-term priority is still to expand substrate capacity from non-China sources, with supply security for the AI industry outweighing price.
2026-06-16
digitimes.com
2026-06-16
After Apple's WWDC 2026 keynote, online rumors claimed that only premium devices with 12GB of memory could run on-device AI, but DIGITIMES analyst Luke Lin said on a podcast that that was just Apple's messaging. Most on-device AI features only need 8GB of memory; only the Apple-defined advanced on-device AI requires the higher 12GB spec.
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
digitimes.com
2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.
2026-06-16
digitimes.com
2026-06-16
China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) — an essential material for building silicon-based quantum computers. The breakthrough builds on a government push to sharpen its quantum research edge and reduce its reliance on foreign technology supply chains more broadly.
2026-06-16
digitimes.com
2026-06-16
South Korea has begun planning a large-scale research and development program for next-generation power semiconductors as part of its broader "Ultra-Innovation Economy Project," according to a report by the Seoul Economic Daily.
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.