Semiconductor News & Analysis Feed
2690 articles
2026-06-18
www.venturesquare.net
2026-06-18
벤처스퀘어
Domestic GaN Semiconductor Surpasses 700GHz Barrier… Achieves World’s Highest Performance with IVWORKS Technology
06/18/2026
Domestic researchers have succeeded in achieving world-class ultra-high frequency performance in the field of next-generation compound semiconductors. Semiconductor materials company IVWorks announced that a gallium nitride (GaN)-based transistor utilizing its selective reg
2026-06-18
www.thelec.net
2026-06-18
thelec.net
Qualcomm unveils the Snapdragon Start Program. (Photo: Qualcomm)
Qualcomm Launches Snapdragon Start Program to Accelerate AI Device Development
Applied Materials, Avegant and Pegatron among ecosystem partners supporting commercialization
Qualcomm unveiled its Snapdragon Start Program on June 17 at the Augmented World Expo (AWE) in Long Beach, California.
Snapdragon Start, short for Scalable Tu
2026-06-18
tomshardware.com
2026-06-18
Mark Tyson
An enterprising young man aims to catch up with the collective wealth of Elon Musk, and his first money spinner is a portable NFT minting gadget.
2026-06-18
tomshardware.com
2026-06-18
Luke James
Attackers have spent the past several months smuggling malware into Steam through animated desktop wallpapers.
2026-06-18
www.govconwire.com
2026-06-18
GovCon Wire
Photo: SandboxAQ
Home
Civilian
SandboxAQ Wins $500M CHIPS Act Award for AI-Driven Semiconductor Material Development
SandboxAQ Wins $500M CHIPS Act Award for AI-Driven Semiconductor Material Development
MILES JAMISON
June 18, 2026
CIVILIAN
,
NEWS
SandboxAQ has received a $500 million CHIPS award from the Commerce Department
Under the definitive agreement, SandboxAQ will advance U.S. semiconductor
2026-06-18
seekingalpha.com
2026-06-18
Seeking Alpha
__fail__
2026-06-18
www.inc.com
2026-06-18
inc.com
__fail__
2026-06-18
news.google.com
2026-06-18
EE Times
2026-06-18
www.indexbox.io
2026-06-18
IndexBox
This website is using a security service to protect itself from online attacks. The action you just performed triggered the security solution. There are several actions that could trigger this block including submitting a certain word or phrase, a SQL command or malformed data.
You can email the site owner to let them know you were blocked. Please include what you were doing when this page came u
2026-06-18
semiengineering.com
2026-06-18
Semiconductor Engineering
Why new designs and process flows could help overcome manufacturing challenges.
Gallium nitride power devices have made significant inroads into low-voltage applications like chargers for consumer electronics. High-voltage applications like power generation and transportation have more demanding requirements and have, so far, been more skeptical of GaN’s potential.
Requirements for power devices
2026-06-18
www.gurufocus.com
2026-06-18
GuruFocus
The owner of this website (www.gurufocus.com) has banned the autonomous system number (ASN) your IP address is in (45102) from accessing this website.
Please see https://developers.cloudflare.com/support/troubleshooting/http-status-codes/cloudflare-1xxx-errors/error-1005/ for more details.
Cloudflare Ray ID: a0f4eacbcf46d6ac • Your IP: Click to reveal • Performance & security by Cloudflare
2026-06-18
evertiq.com
2026-06-18
Evertiq
© Imec
General | June 18, 2026
Imec unlocks system-level III-V chiplet integration on Si-CMOS
Evertiq
By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.
Imec, a Belgium-based research and innovation cen
2026-06-18
in.mashable.com
2026-06-18
Mashable India
Apple May Increase iPhone and Mac Prices Due to Memory Chip Shortage, Tim Cook Reveals
Apple CEO Tim Cook says a global memory chip shortage driven by AI demand could lead to higher iPhone, Mac, and other Apple device prices in the future.
By Priya Singh June 18, 2026
> Tech
Apple could soon increase prices across several of its products as soaring memory and storage chip costs put pressure
2026-06-18
www.wsj.com
2026-06-18
WSJ
__fail__
2026-06-18
digitimes.com
2026-06-18
SK Group's combined market capitalization on the South Korean stock market surpassed KRW2,000 trillion (US$1.32 trillion) for the first time as of the June 16 close, driven by strength in AI memory demand and a high-profile visit by Nvidia's CEO that reinforced ties with SK Hynix and broader AI infrastructure plans. According to reports from SBS, YTN, ET Newsand Yonhap, the group's 19 listed subsi
2026-06-18
digitimes.com
2026-06-18
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering, automation and system integration, while moving into higher-value equipment manufacturing and R&D. Following the opening of Galatek's new facility in Penang, Malaysia, DIGITIMES spoke with Galatek Malaysia general manag
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea's ETNews, which cited industry sources.
2026-06-18
digitimes.com
2026-06-18
Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive industrial base and, amid supply chain diversification and geopolitical shifts, has recently attracted record levels of investment.
2026-06-18
digitimes.com
2026-06-18
Taiwan's 2026 GDP growth is on track to exceed 10% as AI demand powers the island's economy, Minister of Economic Affairs Ming-hsin Kung said, adding that this level of growth may be achieved given current trends. He pointed to stronger-than-expected exports from the AI supply chain and traditional industries such as machinery.
2026-06-18
digitimes.com
2026-06-18
Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.