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Qualcomm’s new Dragonwing MBM silicon solution combines interactive multimedia with top-tier connectivity & on-device AI June 9, 2026 | INTELLIGENT CONNECTIVITY | by Claus Hetting, Wi-Fi NOW CEO & Chairman By Claus Hetting, WiFi NOW CEO & Chairman It is not often that major chipset vendors introduce an entirely new class of AI-enabled connectivity platforms but Qualcomm did exactly that only tw

Primax Electronics has announced a next-generation AI conference solution platform powered by Qualcomm’s (NASDAQ: QCOM) Dragonwing Edge AI processors, marking a notable expansion into enterprise workplace infrastructure. The new system is designed to deliver AI-driven audio and video collaboration capabilities specifically tailored for hybrid meeting rooms and enterprise workplaces. Veterans bra

Innodisk Showcases Full Qualcomm Dragonwing Edge AI Lineup at Computex 2026, Spanning Dragonwing IQ8 Through IQ10 USA - English NEWS PROVIDED BY Innodisk Corporation Jun 08, 2026, 04:22 ET SHARE THIS ARTICLE TAIPEI, June 8, 2026 /PRNewswire/ -- Innodisk, a leading global AI solution provider, showcases the full breadth of its collaboration with Qualcomm Technologies, Inc. at Computex 20

This is a paid press release. Contact the press release distributor directly with any inquiries. Innodisk Showcases Full Qualcomm Dragonwing Edge AI Lineup at Computex 2026, Spanning Dragonwing IQ8 Through IQ10 PR Newswire Mon, June 8, 2026 at 1:22 AM PDT 3 min read 5289 TAIPEI, June 8, 2026 /PRNewswire/ -- Innodisk, a leading global AI solution provider, showcases the full breadth of its collabo

Qualcomm Releases the Dragonwing IQ10 RRD Robotics Platform Computex 2026: Low fricton robotics development in a box Jun 1, 2026 by Charlie Demerjian Tweet Qualcomm is making a platform with their Snapdragon X CPUs that actually works right, the Dragonwing IQ10 RRD. SemiAccurate is happy that Qualcomm is admitting what we have said all along about OSes and thinks this may be a very cool platform

Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se