88 articles
2026-05-17
www.fool.com
2026-05-17
The Motley Fool
Last month,Nvidia(NVDA1.38%)unveiled a family ofopen-sourceartificial intelligence (AI) models designed to address calibration and error-correction challenges in quantum computing. Known asIsing, Nvidia's new toolkit helps make fragile qubits more usable by pairing them with the power of graphics processing units (GPUs).The question smart investors are asking is not whether quantum computing matte
2026-05-17
digitimes.com
2026-05-17
Singapore-based AI automation startup Galatek said it is tackling yield bottlenecks in micron-level packaging with AI-embedded equipment as demand for AI and high-performance computing (HPC) chips surges across Southeast Asia and global markets. The company is also pursuing a dual-track expansion spanning Southeast Asia and Taiwan.
2026-05-15
embeddedcomputing.com
2026-05-15
Embedded Computing Design
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2026-05-15
www.benzinga.com
2026-05-15
Benzinga
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2026-05-14
derspiegel.substack.com
2026-05-14
DER SPIEGEL - The German View
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2026-05-14
news.google.com
2026-05-14
DER SPIEGEL - The German View
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2026-05-14
www.benzinga.com
2026-05-14
Benzinga
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2026-05-14
finance.yahoo.com
2026-05-14
Yahoo Finance
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2026-05-14
digitimes.com
2026-05-14
AP Memory reported that net profit for the first quarter of 2026 rose 91% to NT$660 million (US$20.93 million) as the company scaled mass production of its S-SiCap silicon capacitor and benefited from strong demand for its IoTRAM customized memory. The Taiwan-based chip packaging and memory supplier said silicon capacitor shipments entered a ramp-up phase in the first quarter of 2026 as AI and hig
2026-05-14
digitimes.com
2026-05-14
Etron Technology is seeing momentum extend beyond its core memory business, as subsidiaries built over the past several years begin to bear fruit in robotics, edge computing, and privacy-focused applications.
2026-05-14
digitimes.com
2026-05-14
Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior vice president Kevin Zhang argued that the AI revolution is advancing far faster than anticipated and is reshaping the industry from generative AI and AI agents to inference computing.
2026-05-14
www.reuters.com
2026-05-14
Reuters
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2026-05-14
videocardz.com
2026-05-14
VideoCardz.com
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2026-05-14
embeddedcomputing.com
2026-05-14
Embedded Computing Design
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2026-05-13
digitimes.com
2026-05-13
Moore Threads has entered a strategic partnership with Lightwheel Intelligent (Beijing) Technology (Lightwheel.ai) to jointly develop a domestic simulation and synthetic data infrastructure platform for embodied AI, highlighting China's broader push to reduce reliance on foreign AI computing and robotics software ecosystems.
2026-05-13
digitimes.com
2026-05-13
The global race for AI computing power continues to intensify, beyond ongoing GPU shortages. CPUs, long viewed as secondary components in servers, are once again becoming critical parts of data center infrastructure due to the rapid rise of AI inference and AI agent applications.
2026-05-13
digitimes.com
2026-05-13
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn
2026-05-12
www.scientific-computing.com
2026-05-12
Scientific Computing World
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2026-05-12
digitimes.com
2026-05-12
TSMC is facing fierce customer competition and supply shortages as demand surges for artificial intelligence and high-performance computing chips, forcing fabless chipmakers to consider limited shifts in manufacturing partners to ease constraints.
2026-05-12
digitimes.com
2026-05-12
Taiwan's semiconductor testing and probe card supply chain maintained solid momentum entering 2026, driven by continued AI accelerator, high-performance computing (HPC), and advanced packaging demand.