Semiconductor News & Analysis Feed

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneou

The rapid expansion of AI servers and large language models (LLMs) is driving unprecedented demand for data center computing, making high-speed interconnect technologies one of the next major battlegrounds in AI infrastructure.

While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.

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ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment of a former TSMC executive as an independent director by Chairman Chiang Shang-yi has also drawn industry attention to the commercialization progress of its high-speed optical transceiver business.

AI-driven hyperscale data center expansion is pushing the global AI race beyond raw GPU computing power into a broader contest over high-speed interconnects and electro-optical integration. As Nvidia's next-generation AI factory moves toward petabyte (PB)-scale data transfers, co-packaged optics (CPO) is heading toward commercialization, lifting the importance of key components such as fiber array

Concerns have emerged in recent weeks that the commercialization of co-packaged optics (CPO), a technology widely viewed as the future of AI networking, could face further delays as manufacturing yields remain inconsistent.

Nvidia and Hyundai Motor Group have agreed to deepen their collaboration in artificial intelligence, robotics, and future mobility technologies as the two companies seek to accelerate the commercialization of physical AI and expand South Korea's role in next-generation AI infrastructure.

Intellivix CEO Choi Eun-su (far right) introduces the consortium's "On-Device AI Demonstration Project for Early Wildfire Detection and Autonomous Safety Monitoring Using Domestic AI Semiconductors," developed with Mobilint, to Deputy Prime Minister and Minister of Science and ICT Bae Kyung-hoon at the K-AI Semiconductor Growth Forum held at Lotte Hotel Seoul on June 4. (Photo: Intellivix) South

SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to

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