Semiconductor News & Analysis Feed
5 articles
2026-07-01
semiengineering.com
2026-07-01
As artificial intelligence becomes increasingly integrated into chip design, observability emerges as a critical requirement. In next-generation silicon, AI can interpret system behavior at scale, but only if observability is embedded as a first-class architectural capability. Industry experts agree
2026-07-01
semiengineering.com
2026-07-01
As the AI era unfolds, chip design is increasingly adopting modular architectures such as chiplets. However, a critical missing layer—observability—has not been adequately addressed. In chiplet-based systems, observability must be designed as a fabric-aligned, cross-die telemetry plane to enable arc
2026-05-07
2026-05-07
www.zawya.com
2026-05-07
The UAE has taken a significant step toward building national microelectronics capabilities, following a strategic agreement signed between the Tawazun Council for Defence Enablement and Lockheed Martin during the Make it in the Emirates 2026 event. The initiative, executed in partnership with EDGE
2026-05-07
www.zawya.com
2026-05-07
The Tawazun Council for Defence Enablement and Lockheed Martin have signed a deal to establish a state-of-the-art chiplet design and assembly facility in the UAE, marking a significant step toward enhancing the country's indigenous microelectronics capabilities. This initiative, announced during the