Semiconductor News & Analysis Feed

Written by: Rita Tide Guide Morgan Stanley released its latest AI supply chain report on July 8, providing a comprehensive update on CoWoS advanced packaging allocations and ASIC dynamics for 2027. The report’s core assessment is that global CoWoS demand will reach 2.694 million wafers in 2027, a 93% increase from 1.394 million wafers in 2026. NVIDIA remains the largest shareholder (1.222 millio

Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity in Malaysia, aiming to capture demand from a shifting global semiconductor supply chain.

United States/Semiconductors/NYSE:TSM Taiwan Export Review Puts TSMC AI Chip Growth And Valuation In Focus June 11, 2026 Simply Wall St Reviewed by Bailey Pemberton Share Copy Link Taiwan is weighing stricter controls on exports of advanced AI chips to China, including possible criminal penalties for violations. The review focuses on the most advanced AI accelerators and supporting technologies th