Semiconductor News & Analysis Feed

SEOUL, June 18 (Yonhap) -- SK hynix Inc. said Thursday it has begun shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, to major global customers, marking another step in the race to supply next-generation memory for artificial intelligence (AI) applications. "The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM deve

By Heekyong Yang SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher. The South Korean ​tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its

By Heekyong Yang SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher. The South Korean ​tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its

By Heekyong Yang SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher. The South Korean ​tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its

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