Semiconductor News & Analysis Feed
841 articles
2026-07-03
digitimes.com
2026-07-03
China's memory price rally continues to gather momentum. Giantec Semiconductor Corporation, a Chinese NOR flash supplier, recently notified its distribution partners that prices for its entire NOR flash memory product portfolio will increase by 25% beginning July 6, 2026. The new pricing will apply to both newly signed orders and outstanding orders that have yet to be delivered.
2026-07-03
digitimes.com
2026-07-03
Inflationary pressures are hitting the semiconductor supply chain in 2026 as Chinese power device makers raise prices, while Taiwan-based firms say their flexibility, quality, and service advantages are becoming more visible as the search for non-China supply chains gains momentum.
2026-07-03
www.thewirechina.com
2026-07-03
The Wire China
www.thewirechina.com
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2026-07-03
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2026-07-03
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Innoscience Says Infineon Removes Court-Enjoined Gan Products From Electronica China 2026 Booth
Innoscience Says Infineon Removes Court-Enjoined Gan Products From Electronica China 2026 Booth
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Cash App parent settles states' probe over fraud
2026-07-02
finance.yahoo.com
2026-07-02
Yahoo Finance
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Innoscience Secures Removal of Court-Enjoined Infineon GaN Products from Display at electronica China 2026
PR Newswire
Thu, July 2, 2026 at 8:09 AM PDT 3 min read
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SHANGHAI, July 2, 2026 /PRNewswire/ -- Infineon Technologies was forced to remove certain gallium nitride (GaN
2026-07-02
247wallst.com
2026-07-02
24/7 Wall St.
The story rippling through memory stocks this week began on CNBC’s Fast Money on June 29, where the panel dug into a report that Apple is trying to source memory chips from Chinese manufacturer CXMT. The company Apple (NASDAQ:AAPL | AAPL Price Prediction) wants to buy from is not yet on the US entity list, unlike YMTC, which already is.
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For Micron Technology (NASDAQ:MU), whose Mobile
2026-07-02
finance.yahoo.com
2026-07-02
Yahoo Finance
Apple’s Rumored China Chip Deal Could Blow a Hole in Micron and Trap the US for Years
Omor Ibne Ehsan
Thu, July 2, 2026 at 6:13 AM PDT 4 min read
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Apple is reportedly targeting Chinese fab CXMT for LPDDR5X memory, threatening Micron's $12 billion mobile segment despite its 85% gross ma
2026-07-02
www.thelec.net
2026-07-02
thelec.net
Groundbreaking ceremony for the AMB ceramic substrate plant of Donghan Semiconductor Guangdong Co., Ltd., STI's Chinese subsidiary, held on June 25 in Baiyun District, Guangzhou, China. (Photo: Baiyun District, Guangzhou)
STI has begun construction of its power semiconductor materials production base in Guangzhou, China, about four months after signing an investment agreement with the city's Baiy
2026-07-02
www.scmp.com
2026-07-02
South China Morning Post
Semiconductors
TechBig Tech
Inside CXMT’s US$4.3b IPO: soaring profits meet US export threat and high-stakes HBM race
CXMT is taking orders for its advanced DDR5 server memory from Tencent and ByteDance after completing customer validation, a source says
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Howard Liuin Beijing
Published: 4:46pm, 2 Jul 2026
As China’s leading DRAM maker ChangXin Me
2026-07-02
www.koreatimes.co.kr
2026-07-02
The Korea Times
Two headlines in June should shape Korea’s artificial intelligence (AI) debate. The first was a victory lap. SK hynix overtook Samsung Electronics by common-share market capitalization for a day, powered by high-bandwidth memory (HBM) chips used in AI systems. Samsung has a fair caveat: If preferred shares are included, it remains larger. But the market signal was clear. AI has turned memory from
2026-07-02
digitimes.com
2026-07-02
China's power semiconductor makers are entering a broader price-hike cycle, as AI server demand, raw material inflation, and tight mature-node capacity force suppliers to defend margins after years of low-end price wars.
2026-07-02
digitimes.com
2026-07-02
China's display makers, led by BOE Technology (BOE), are pushing deeper into semiconductors, with BOE advancing glass substrates, and a 12-inch wafer fab reportedly slated to begin mass production in the second half of 2026. Industry analysts say China is extending display technologies built up with strong government backing into semiconductors as the US tightens restrictions, adding pressure on S
2026-07-02
thediplomat.com
2026-07-02
The Diplomat – Asia-Pacific
China faces three specific barriers as it aims to produce key chipmaking equipment. Monitoring progress in these areas would help Western countries make better chip and AI policy.
For the past 20 years, advanced semiconductor manufacturing has been dominated by a small set of companies in the Netherlands, Japan, Germany, Taiwan, South Korea, and the United States, largely due to the proprietary t
2026-07-01
www.forbes.com
2026-07-01
Forbes
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2026-07-01
247wallst.com
2026-07-01
24/7 Wall St.
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2026-07-01
finance.yahoo.com
2026-07-01
Yahoo Finance
China Is Coming For Micron's Thick Margins
Trefis Team
Wed, July 1, 2026 at 6:33 AM PDT 5 min read
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The Squeeze That Created An Opening
The proximate cause is the AI memory supercycle. Conventional DRAM contract prices surged between 93% and
2026-07-01
www.trefis.com
2026-07-01
Trefis
China Is Coming For Micron’s Thick Margins
July 1st, 2026 by Trefis Team
-34.10%
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Trefis
MU
Micron Technology
The memory industry is in the middle of an unprecedented boom.
AI servers are driving up unprecedented demand for high-bandwidth memory; supply remains tight, and DRAM prices have surged, forcing PC and smartphone makers to look beyond their traditional suppliers.
2026-07-01
www.bloomberg.com
2026-07-01
Bloomberg.com
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2026-07-01
www.odaily.news
2026-07-01
odaily.news
In a research note released on June 26, UBS provided a more detailed picture of the spreading demand within China's AI hardware chain: demand for AI infrastructure remains robust, and the pull factors now extend beyond GPUs to include PCBs, optical interconnects, liquid cooling, SiC substrates, and optical communication materials.
2026-07-01
www.odaily.news
2026-07-01
odaily.news
In a research note released on June 26, UBS provided a more detailed picture of the spreading demand within China's AI hardware chain: demand for AI infrastructure remains robust, and the pull factors now extend beyond GPUs to include PCBs, optical interconnects, liquid cooling, SiC substrates, and optical communication materials.