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South Korea's exports surpassed US$100 billion in a single month for the first time in June 2026, raising expectations that the country could exceed US$1 trillion in annual exports this year. While the milestone underscores the strength of South Korea's export sector, it has also renewed debate over the economy's growing dependence on semiconductors.

Samsung brings HBM, logic, and optics together in packaging push

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digitimes.com 2026-07-14

Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising power consumption and data-transfer bottlenecks facing AI data centers.

Bosch starts sample production at its first US chip plant after securing up to US$225 million

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digitimes.com 2026-07-14

German automotive supplier and chipmaker Bosch has begun sample production at its first US semiconductor factory after finalizing an agreement for up to US$225 million in federal funding. Commercial production of silicon carbide chips at the Roseville, California, site is expected to begin in 2026.

Trusval sets record first-half revenue as AI factory demand pushes orders to 2027

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digitimes.com 2026-07-14

Trusval Technology posted record revenue in the second quarter and first half of 2026, supported by demand tied to global AI infrastructure buildouts and continued expansion of advanced process and advanced packaging capacity by semiconductor makers. The company said order visibility has now extended through 2027.

Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

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digitimes.com 2026-07-14

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization targeted for around 2030. Although the path is fraught with ecosystem barriers and compatibility hurdles, Intel's parallel development of Z-angle memory (ZAM) and cross-batch memory (XBM) underscores its determination to re-enter the DRAM market, as it simultaneou

Six-inch SiC substrate price rebounds as supply tightens

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digitimes.com 2026-07-14

Six-inch silicon carbide (SiC) substrates, a third-generation semiconductor product that has faced oversupply and falling prices for the past two years, have clearly bottomed out and are even starting to recover as capacity remains constrained and demand emerges across multiple sectors. Semiconductor distributors say supply is now tight, and customers who want to buy more must pay more, with new o

Commentary: Huawei builds NPO alliance to shape CPO-era optical interconnect standards

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digitimes.com 2026-07-14

The AI race is expanding from computing power to data transmission, making optical interconnects a critical battleground for next-generation AI infrastructure.

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