Semiconductor News & Analysis Feed
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2026-06-25
news.futunn.com
2026-06-25
富途牛牛
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2026-06-25
kfgo.com
2026-06-25
The Mighty 790 KFGO
By Heekyong Yang and Hyunjoo Jin
SEOUL, June 25 (Reuters) – South Korean semiconductor shares rallied on Thursday after U.S. memory chipmaker Micron Technology’s quarterly results and forecast beat expectations, boosting optimism over AI-driven chip shortages.
South Korea’s SK Hynix also said on Wednesday it plans to raise up to $29.4 billion through a U.S. stock market listing, boosting inves
2026-06-25
www.bloomberg.com
2026-06-25
Bloomberg
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2026-06-25
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2026-06-25
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2026-06-25
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2026-06-25
Reuters
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2026-06-25
www.scmp.com
2026-06-25
South China Morning Post
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China’s JCET to build new plant in Shanghai to expand advanced chip packaging
US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development
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Xinmei Shen
Published: 8:30am, 25 Jun 2026
Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics
2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
Korean chip shares surge on Micron's blowout earnings, SK Hynix's US listing plan
Heekyong Yang and Hyunjoo Jin
Wed, June 24, 2026 at 5:19 PM PDT 2 min read
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By Heekyong Yang and Hyunjoo Jin
SEOUL, June 25 (Reuters) - South Korean semiconductor shares rallied on Thursday after U.S. memory chipmaker Micron Technol
2026-06-25
www.investing.com
2026-06-25
Investing.com
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2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-25
digitimes.com
2026-06-25
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains for silicon photonics (SiPh), AI servers, and advanced chips are tightening, while new capacity is expected to ease bottlenecks and shape revenue growth in 2026 and 2027.
2026-06-25
digitimes.com
2026-06-25
Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations, as cumulative revenue from the company's latest HBM generation has crossed the US$1 billion mark and demand tied to AI chips continues to rise.
2026-06-25
digitimes.com
2026-06-25
Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation CPU agreement with Meta, a strategic bid to diversify beyond a shrinking smartphone business and challenge Nvidia's dominance — while courting Chinese demand and leaning on manufacturing partner TSMC.
2026-06-25
digitimes.com
2026-06-25
MediaTek is reportedly strengthening its partnership with Google in ASICs, a move that could increase the scale of future orders and carry implications for AI infrastructure worldwide. Market talk suggests the company may build an upgraded triggerfish product for Google, underscoring how global chipmakers are vying for influence in TPU development.
2026-06-25
digitimes.com
2026-06-25
National Silicon Industry Group, China's leading 12-inch silicon wafer maker, has announced a CNY11.45 billion (US$1.6 billion) capital injection into its core subsidiary Shanghai Xinsheng Semiconductor Technology, in a restructuring aimed at easing losses in its wafer business.
2026-06-25
semiengineering.com
2026-06-25
Liz Allan
Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnec...
2026-06-25
digitimes.com
2026-06-25
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics' foundry business, with its 2028 turnaround target hinging on stable operations at the Taylor plant and landing major orders.
2026-06-25
digitimes.com
2026-06-25
Rising demand for AI server builds is tightening the global supply of high-end MLCCs, driving steep price increases in China's electronics distribution market and exposing how quickly infrastructure demand can affect component costs worldwide. The rally underscores a structural mismatch that could keep pressure on buyers across technology supply chains for years, according to industry sources.
2026-06-25
digitimes.com
2026-06-25
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing close market attention to how the rivalry with ASE and Amkor will reshape market share. ASE Chief Operating Officer Tien Wu said he is "optimistic," stating that strong demand from US customers and the need to divers
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-25
digitimes.com
2026-06-25
OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model developers want to design their own chips and broaden a supply chain long dominated by Nvidia.