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2026-05-29
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2026-05-29
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2026-05-29
www.asiae.co.kr
2026-05-29
아시아경제
Mandatory Priority Supply of Key Products During Semiconductor Shortages
Fines of Up to 300,000 Euros for Refusing to Provide Supply Chain Information
120 Billion Euros in Investment Needed by 2035
The European Union (EU) is pushing ahead with its own version of the Chips Act and is considering granting the legislation significant emergency powers. One of the measures under review would allow the
2026-05-29
www.asiae.co.kr
2026-05-29
아시아경제
Mandatory Priority Supply of Key Products During Semiconductor Shortages
Fines of Up to 300,000 Euros for Refusing to Provide Supply Chain Information
120 Billion Euros in Investment Needed by 2035
The European Union (EU) is pushing ahead with its own version of the Chips Act and is considering granting the legislation significant emergency powers. One of the measures under review would allow the
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
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Reference #18.4d0f3417.1780113542.d2e028
https://errors.edgesuite.net/18.4d0f3417.1780113542.d2e028
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-29
digitimes.com
2026-05-29
South Korean fabless chip-design company DeepX is using Computex 2026 to broaden partnerships around its neural processing units, or NPUs, as it pushes low-power AI chips for industrial and edge applications.
2026-05-29
digitimes.com
2026-05-29
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply tighten worldwide. For readers across global tech markets, the shift means access to manufacturing capacity, not just chip design, is becoming the main determinant of who can supply the next wave of AI hardware.
2026-05-29
digitimes.com
2026-05-29
The European Commission wants governments to buy chips from EU startups as Brussels seeks to reduce the bloc's reliance on US and East Asian suppliers, Reutersreported, citing a document it has seen.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads.
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.
2026-05-29
digitimes.com
2026-05-29
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
digitimes.com
2026-05-29
Airoha Technology is sharpening its strategy around global networking and edge AI chips, aiming to expand its customer base and strengthen its competitive moat. The MediaTek subsidiary is targeting infrastructure, audio, and positioning markets with products already shipping, in production, or advancing through development milestones that could matter to users and operators worldwide.
2026-05-29
digitimes.com
2026-05-29
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa, as the electronics manufacturer looks beyond AI servers for its next phase of growth.
2026-05-29
digitimes.com
2026-05-29
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.
2026-05-29
digitimes.com
2026-05-29
MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek's market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 202
2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
www.semafor.com
2026-05-29
Semafor
Nvidia CEO Jensen Huang is set to join the advisory board of an elite Chinese university, which counts Tim Cook, Elon Musk, and Mark Zuckerberg among its 65 members, the Financial Times reported.
The board at the Tsinghua University School of Economics and Management, which also includes the heads of JPMorgan and BlackRock, is a rare forum uniting corporate and academic leaders from the US and Ch