Feed Deep Dive Matrix Subscribe About

Semiconductor News & Analysis Feed

1846 articles
Trending Companies
NVIDIA667 TSMC228 Intel150 AMD117 Micron Technology110 Broadcom91 SK Hynix90 Samsung80 Micron80 SpaceX68 ASML61 Google57 Microsoft56 Samsung Electronics54 Amazon54
Trending Technologies
EUV491 3nm447 AI209 AI chips180 GPU161 DRAM83 HBM79 AI infrastructure75 semiconductor73 data center56 memory chips45 GaN45 AI accelerators42 CPU41 semiconductor manufacturing39
2026-05-27
ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation - 01net
0.92
www.01net.it 2026-05-27 01net
www.01net.it Performing security verification This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot. Ray ID: a0204953bd51d6e9 Performance and Security by Cloudflare Privacy
Semiconductor PackagingAI Chips310mm PanelAutomated ProductionWafer-Level PackagingAI InnovationSemiconductor ManufacturingChip Packaging
2026-05-26
AMD leaves Linux FPGA users in the lurch with controversial Vivado licensing update
0.87
tomshardware.com 2026-05-26 Zak Killian
AMD has been accused of 'bait-and-switch' tactics following changes to the licensing of Vivado on Linux.
FPGAAMDVivadoLinuxOpen SourceChip DesignLicensing PolicySemiconductor Tools
2026-05-26
Fujifilm Presents Latest Advanced Packaging Research Results and Will Introduce PFAS-Free PBO at ECTC 2026 - The Joplin Globe
0.92
www.joplinglobe.com 2026-05-26 The Joplin Globe
TOKYO & NORTH KINGSTOWN, R.I.--(BUSINESS WIRE)--May 26, 2026-- FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES 1 product line of photosensitive insulating materials, including PFAS-free 2 PBO, at the Electronic Components and Technology Conference 2026 (ECTC 2026), May 26–29, 2026, in Orlando, Florida. As part of the
Semiconductor PackagingAdvanced PackagingFujifilmECTC ConferencePFAS-Free MaterialsPBO MaterialFluorine-Free MaterialsElectronic Materials
2026-05-26
Fujifilm Presents Latest Advanced Packaging Research Results and Will Introduce PFAS-Free PBO at ECTC 2026 - Yahoo Finance Singapore
0.75
sg.finance.yahoo.com 2026-05-26 Yahoo Finance Singapore
__fail__
2026-05-26
Fujifilm Presents Latest Advanced Packaging Research Results and Will Introduce PFAS-Free PBO at ECTC 2026 - Yahoo Finance
0.75
finance.yahoo.com 2026-05-26 Yahoo Finance
__fail__
2026-05-26
'The Big Short' Investor Michael Burry Just Issued a Dire Warning About Nvidia. Here's Why He Thinks an 'Aggressive Fall' Is Coming, and How Businesses Can Avoid the Same Fate - inc.com
0.85
www.inc.com 2026-05-26 inc.com
__fail__
2026-05-26
Micron Hits $1 Trillion Market Value—Latest Winner Of AI Chip Boom - Forbes
0.92
www.forbes.com 2026-05-26 Forbes
BREAKING BUSINESS Micron Joins The Trillion-Dollar Club After Surging 18% Tuesday ByAlicia Park, Reporter. I cover markets and tech. Follow Author May 26, 2026, 11:12am EDTMay 26, 2026, 11:17am EDT TOPLINE Chipmaker Micron Technology hit a $1 trillion market value for the first time Tuesday after shares jumped 18%, topping $890, fueled by a Wall Street upgrade signaling that memory chips are
Semiconductor IndustryAI ChipsMemory ChipsMicron TechnologyMarket CapitalizationChip ManufacturerNasdaqArtificial Intelligence
2026-05-26
GPU-HBM Packaging Welcomes New Fiber Interconnection Solution. "Optical-In Copper-Out" Accelerates, Optical Communication Sector Leads Gains in Early Trading. - TradingKey
0.92
www.tradingkey.com 2026-05-26 TradingKey
Optical communication stocks surged on May 26 due to advancements in GPU-HBM integration using fiber optic interconnects. This innovative solution overcomes physical limitations of traditional 2.5D packaging by decoupling compute and memory units, allowing greater HBM capacity and improved thermal management. If successful, it will expand optical interconnects beyond data centers and benefit silic
GPUHBMFiber Optic Interconnect2.5D PackagingAI WorkloadsOptical CommunicationSemiconductor PackagingSilicon Photonics
2026-05-26
Applied Materials stock hits all-time high at 448.62 USD - Investing.com
0.75
www.investing.com 2026-05-26 Investing.com
__fail__
2026-05-26
QUALCOMM Incorporated (QCOM) Is a Trending Stock: Facts to Know Before Betting on It - Yahoo Finance
0.75
finance.yahoo.com 2026-05-26 Yahoo Finance
__fail__
2026-05-26
Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers - Microchip Technology
0.92
ir.microchip.com 2026-05-26 Microchip Technology
Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers May 26, 2026 8:00 am EDT Download as PDF New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation CHANDLER, Ariz., May 26, 2026 (GLOBE NEWSWIRE) -- Microchip Technology (Nasdaq: MCHP) today announces the ava
Silicon CarbidePower ModulesSolid-State TransformersAI Data CentersHigh Voltage Power ApplicationsThermal PerformanceEfficiencymSiC Technology
2026-05-26
GAA winners and losers after chaotic weekend sees Kilkenny eliminated - Extra.ie
0.92
extra.ie 2026-05-26 Extra.ie
We and our 1729 partners use cookies and other tracking technologies to improve your experience on our website. We may store and/or access information on a device and process personal data, such as your IP address and browsing data, for personalised advertising and content, advertising and content measurement, audience research and services development. Additionally, we may utilize precise geoloca
Semiconductor IndustryChip ManufacturingTSMCNVIDIAAdvanced Process3nm ProcessEUV LithographyAI Chips
2026-05-26
Texas Instruments Incorporated (TXN) Rallied as Guidance Surpassed Expectations - Insider Monkey
0.92
www.insidermonkey.com 2026-05-26 Insider Monkey
__fail__
2026-05-26
Texas Instruments Incorporated (TXN) Rallied as Guidance Surpassed Expectations - Yahoo Finance UK
0.75
uk.finance.yahoo.com 2026-05-26 Yahoo Finance UK
__fail__
2026-05-26
Texas Instruments Incorporated (TXN) Rallied as Guidance Surpassed Expectations - Yahoo Finance
0.92
finance.yahoo.com 2026-05-26 Yahoo Finance
__fail__
2026-05-26
SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers - Tom's Hardware
0.95
www.tomshardware.com 2026-05-26 Tom's Hardware
__fail__
2026-05-26
Did Nvidia Just Say "Checkmate" to Intel and AMD? - Yahoo Finance
0.88
finance.yahoo.com 2026-05-26 Yahoo Finance
__fail__
2026-05-26
Did Nvidia Just Say "Checkmate" to Intel and AMD? - The Motley Fool
0.92
www.fool.com 2026-05-26 The Motley Fool
__fail__
2026-05-26
Fisher Asset Management LLC Sells 54,160 Shares of Qualcomm Incorporated $QCOM - MarketBeat
0.7
www.marketbeat.com 2026-05-26 MarketBeat
__fail__
2026-05-26
Hantz Financial Services Inc. Sells 2,304 Shares of Qualcomm Incorporated $QCOM - MarketBeat
0.7
www.marketbeat.com 2026-05-26 MarketBeat
__fail__