Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers - Microchip Technology

Microchip Technology has launched its new 3.3 kV HV-D3 mSiC® power modules to accelerate the adoption of solid-state transformers (SSTs) in AI hyperscale data centers. As AI data centers scale, power ... Read original →

Microchip’s 3.3 kV mSiC modules are not just components—they’re enablers of a fundamental power architecture shift in AI data centers. Technically, their ability to directly interface medium-voltage grids with server racks forces co-evolution in gate drivers, power ICs, and thermal interface materials, catalyzing a high-voltage SiC ecosystem. Regulatory-wise, U.S. CHIPS Act subsidies for domestic advanced packaging accelerate onshoring, yet SiC substrate reliance on Wolfspeed and Japanese suppliers leaves supply chain vulnerabilities. Competitively, Infineon and ST will likely counter with tighter integration or lower RDS(on), pivoting from saturated automotive SiC markets to data centers as the new battleground. Within 18 months, successful SST deployments at Meta or Microsoft could reset PUE benchmarks and pressure foundries like TSMC and Samsung to fast-track high-voltage SiC BCD processes—proving that power efficiency, not just transistor count, is now the true bottleneck of AI scalability.