Semiconductor News & Analysis Feed
24 articles
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-27
eetimes.com
2026-05-27
This paper explores how configurable and intelligent I/O technologies are transforming industrial control systems by enabling greater flexibility, improved thermal performance, and higher system uptime. Traditional fixed-function I/O architectures, while effective in stable environments, create inefficiencies through SKU proliferation, underutilized channels, and limited adaptability to late-stage
2026-05-27
www.newelectronics.co.uk
2026-05-27
New Electronics
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Neil Tyler
27 May 2026
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STMicroelectronics introduces 700V GaN devices to improve power efficiency
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STMicroelectronics has launched a new range of gallium nitride (GaN)-based power semiconductors aimed at improving energy efficiency and power dens
2026-05-26
newsroom.st.com
2026-05-26
STMicroelectronics
700V PowerGaN devices improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications including home appliances
Alexander Jurman
Technical Media Relations
Tel. +420602748611
alexander.jurman@st.com
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New gallium nitride (GaN)-based power semicondu
2026-05-26
digitimes.com
2026-05-26
Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing strong demand for high-efficiency power solutions in AI servers. The company is also beginning to see emerging demand from diversified applications such as AI robotics. As a result, production capacity in 2026 has alread
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo
2026-05-22
pluang.com
2026-05-22
Pluang
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2026-05-22
en.antaranews.com
2026-05-22
ANTARA News
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2026-05-21
newshub.medianet.com.au
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aijourn.com
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www.streetinsider.com
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StreetInsider
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2026-05-21
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2026-05-21
www.bastillepost.com
2026-05-21
巴士的報
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2026-05-21
www.eagletribune.com
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Eagle-Tribune
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2026-05-21
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2026-05-20
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www.tradingview.com
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TradingView
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www.ad-hoc-news.de
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AD HOC NEWS
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www.tweaktown.com
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TweakTown
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