Semiconductor News & Analysis Feed
10428 articles
2026-05-27
www.siliconrepublic.com
2026-05-27
Silicon Republic
BUSINESS
Micron, SK Hynix hit $1trn valuation amid AI chip demand
27 MAY 2026
SAVE ARTICLE
Image: © MakZin/Stock.adobe.com
Micron and SK Hynix join rival chipmaker Samsung in the $1trn club, after the latter hit the milestone valuation at the start of the month.
Leading chipmakers Micron and SK Hynix have both surpassed $1trn in market value, as AI drives demand for the companies’ memory
2026-05-27
sammyguru.com
2026-05-27
SammyGuru
Samsung may launch a Physical AI chiplet platform next year in collaboration with Cadence. The platform could support applications like robotics, autonomous driving, and industrial automation. It is being developed using the Korean foundry’s SF5A (5nm) process technology.
In January 2026, Samsung and Cadence announced a partnership to develop a chiplet-based Physical AI semiconductor platform. Un
2026-05-27
www.marketwatch.com
2026-05-27
MarketWatch
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2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.marketscreener.com
2026-05-27
marketscreener.com
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2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.communicationstoday.co.in
2026-05-27
Communications Today
COMPANY NEWS
SK hynix unveils ‘iHBM’ technology to reduce HBM heat
May 27, 2026
SK hynix on May 26 unveiled a new thermal management technology called “iHBM,” designed to address heat generation issues in high-bandwidth memory (HBM) products operating at increasingly higher speeds.
The key feature of iHBM is an integrated thermal control component called ICE, embedded directly inside the HBM pac
2026-05-27
en.cryptonomist.ch
2026-05-27
The Cryptonomist
HomeZ - Banner home engSK Hynix trillion valuation jumps after 12% record rally on HBM
Z - Banner home eng
SK Hynix trillion valuation jumps after 12% record rally on HBM
27 May 2026
Share
SK Hynix trillion valuation lifts $1T memory-chip race on HBM
SK Hynix trillion valuation became one of Wednesday’s biggest market stories after the South Korean memory-chip giant surged past the $1 trillion m
2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.bloomberg.com
2026-05-27
Bloomberg.com
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2026-05-27
www.zacks.com
2026-05-27
Zacks Investment Research
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2026-05-27
www.indexbox.io
2026-05-27
IndexBox
Thermal management has become the primary limiting factor in high-performance computing and AI accelerator packaging. Contemporary packages combine high-power ASICs with multiple High Bandwidth Memory stacks on a silicon interposer, resulting in closely linked thermal and mechanical interactions. Thermal crosstalk between dies increases HBM junction temperatures, while mismatched coefficients of t
2026-05-27
www.msn.com
2026-05-27
MSN
Investor enthusiasm for AI infrastructure stocks sent SK Hynix (HXSCL) shares sharply higher on Wednesday, with the stock gaining as much as 11% and lifting the company’s valuation beyond the $1T mark.
The South Korean chipmaker has been one of the biggest beneficiaries of the AI spending boom, with its shares up roughly 231% this year as demand for high-bandwidth memory chips continues to surge.
2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
eetimes.com
2026-05-27
We now know what China’s been working on to counter U.S. sanctions on EUV technology.
2026-05-27
www.investing.com
2026-05-27
Investing.com
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2026-05-27
seekingalpha.com
2026-05-27
Seeking Alpha
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2026-05-27
semiengineering.com
2026-05-27
Semiconductor Engineering
Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages.
Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging.
Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer,
2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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