Semiconductor News & Analysis Feed
401 articles
2026-06-30
digitimes.com
2026-06-30
Samsung Electro-Mechanics is in final-stage talks to supply multilayer ceramic capacitors (MLCCs) to a major US cloud provider for AI servers, while also expanding substrate production capacity and securing a separate silicon capacitor contract, according to Korean media reports and company statements.
2026-06-30
digitimes.com
2026-06-30
AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.
2026-06-30
digitimes.com
2026-06-30
Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.
2026-06-30
digitimes.com
2026-06-30
Rumors in Taiwan's capital markets that United Microelectronics Corp. may deepen cooperation with Intel from 12nm to Intel 3 are drawing skepticism from DIGITIMESanalyst Luke Lin. He said the main obstacles are the technology gap and Intel's internal capacity allocation, which make a near-term move commercially difficult.
2026-06-30
digitimes.com
2026-06-30
TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.
2026-06-29
www.einpresswire.com
2026-06-29
EIN Presswire
There were 1,599 press releases posted in the last 24 hours and 478,683 in the last 365 days.
On-demand programming support helps U.S. manufacturers clear bottlenecks in semiconductor, aerospace, and medical production driven by AI demand and CHIPS Act.
ALBUQUERQUE, NM, UNITED STATES, June 29, 2026 /EINPresswire.com/ -- With over $640 billion in announced semiconductor supply chain investments s
2026-06-29
www.kedglobal.com
2026-06-29
KED Global
S.Korea unveils $590 bn chip investment plan for new fabs, packaging
SK Hynix's Icheon Campus in Gyeonggi Province (Courtesy of SK Hynix) South Korea on Monday unveiled a 911 trillion won ($591 billion) semiconductor investment plan spanning new memory fabs in the southwest, an advanced packaging cluster in the Chungcheong region and a supply chain hub in the so
2026-06-29
stocktwits.com
2026-06-29
Stocktwits
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2026-06-29
www.tradingview.com
2026-06-29
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DRAM Dips Premarket: Samsung, SK Hynix Announce $590B Expansion Push As South Korea Plans To Double DRAM Capacity
DRAM Dips Premarket: Samsung, SK Hynix Announce $590B Expansion Push As South Korea Plans To Double DRAM Capacity
2 min read
005930
−9.75%
000660
−10.46%
KEY POINTS:
Samsung and SK Hynix shares recouped losses from earlier in the day in Seoul as the official announc
2026-06-27
digitimes.com
2026-06-27
A US$250 million award for I-Pulse's semiconductor and pulsed power research could have implications far beyond the US, potentially affecting energy, mining, defense, and chip supply chains used by industries worldwide. The funding is aimed at domestic capacity, but the technologies being developed may shape global competition and access.
2026-06-27
digitimes.com
2026-06-27
Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could have a lifecycle of only about two years.
2026-06-27
digitimes.com
2026-06-27
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
2026-06-26
digitimes.com
2026-06-26
SK Hynix is pairing a potentially record-scale Nasdaq ADR offering with an aggressive push to expand chip production for artificial intelligence, as the South Korean memory maker prepares to nearly double DRAM wafer input capacity by 2030–2031, The Elecreported.
2026-06-26
digitimes.com
2026-06-26
SK Hynix is racing to complete the first cleanroom at its massive Yongin Semiconductor Cluster in Gyeonggi Province, South Korea, by February 2027, ahead of rival capacity expansion timelines. The site's first fabrication facility will break from conventional flat-floor layouts, stacking production floors three levels high in a pioneering triple-deck fab design.
2026-06-26
digitimes.com
2026-06-26
GlobalFoundries (GF) is positioning its Singapore operations as a core hub for the emerging era of physical AI, as the chipmaker expands investment in manufacturing capacity and next-generation semiconductor technologies aimed at robotics, autonomous systems, and AI-driven infrastructure.
2026-06-26
digitimes.com
2026-06-26
China's power semiconductor makers are lifting prices again as demand from artificial intelligence (AI) servers and new energy vehicles strengthens. The moves may signal a broader industry upcycle with global implications, as higher costs and tighter capacity could affect data centers, automotive suppliers, and power equipment buyers worldwide.
2026-06-26
digitimes.com
2026-06-26
SK Siltron is preparing to bring a new silicon wafer manufacturing facility online in South Korea next month. The expansion comes as AI data center investment helps lift wafer shipments, while pricing remains under pressure as capacity added during the last expansion cycle continues to weigh on the market.
2026-06-25
www.tomshardware.com
2026-06-25
Tom's Hardware
Tech Industry Artificial Intelligence
Qualcomm reveals HBC near-memory AI architecture, AI250 and AI350 accelerators — touts 6x higher bandwidth-per-watt compared to HBM, 200x capacity compared to on-chip SRAM
News
By Anton Shilov published 22 hours ago
More efficient than HBM, denser than SRAM.
Qualcomm unveils HBC near-memory AI architecture, claims it has broken the memory wall. (Image credi
2026-06-25
m.techflowpost.com
2026-06-25
深潮TechFlow
研报解读：台积电 2027 年 AI 收入将翻倍，CoWoS 产能仍是瓶颈
2026.06.25
- 昨天
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研报解读：台积电 2027 年 AI
收入将翻倍，CoWoS 产能…
即便台积电将 CoWoS 产能扩至每月 20 万片，仍可能满足不了全球 269 万片的需求缺口。
2026.06.25 - 11:48:07
台积电
AI
专注Web3行业深度报道，洞察潮水流动的方向
即便台积电将 CoWoS 产能扩至每月 20 万片，仍可能满足不了全球 269 万片的需求缺口。
作者：Rita
潮向导读
摩根士丹利于 6 月 23 日发布台积电供应链深度报告。核心判断：基于最新供应链调查，上调了对 2027 年全球 CoWoS 先进封装需求的预测，认为台积电 AI 相关收入 2027 年将达 863 亿美元，较
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.