Semiconductor News & Analysis Feed

2649 articles
2026-05-26
digitimes.com 2026-05-26
Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.
2026-05-26
digitimes.com 2026-05-26
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
2026-05-26
digitimes.com 2026-05-26
When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners and the island's broader semiconductor ecosystem. The goal, she said, was to help secure a long-term supply of advanced artificial intelligence (AI) chips.
2026-05-26
digitimes.com 2026-05-26
Facing expanding opportunities in both optical communications and satellite connectivity, Dennis Chen, chairman of WIN Semiconductors, said the company is actively advancing a range of products, including driver ICs, continuous-wave (CW) lasers, and photodiodes, while also ramping up capacity in anticipation of growing demand from next-generation networks.
2026-05-26
digitimes.com 2026-05-26
When Huawei unveiled its "Tau (τ) Scaling Law" at ISCAS 2026 in Shanghai, the announcement signalled more than another chip architecture update. It marked China's most ambitious attempt yet to redefine how semiconductor performance is measured in the post-Moore era.
2026-05-26
digitimes.com 2026-05-26
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutt
2026-05-26
ca.finance.yahoo.com 2026-05-26 Yahoo! Finance Canada
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2026-05-26
finance.yahoo.com 2026-05-26 Yahoo Finance
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2026-05-26
www.digitimes.com 2026-05-26 digitimes
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time t
2026-05-26
www.digitimes.com 2026-05-26 digitimes
Taiwan Semiconductor Manufacturing Company (TSMC) will reportedly cut employee bonuses by 15%, prompting some employees to voice dissatisfaction on social media. They argued that while TSMC's profits have soared, the share allocated to employee bonuses has... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time t
2026-05-26
koreajoongangdaily.joins.com 2026-05-26 Korea JoongAng Daily
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2026-05-26
www.thestreet.com 2026-05-26 thestreet.com
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2026-05-26
www.techtimes.com 2026-05-26 Tech Times
By Allen Lee Published: May 25 2026, 16:47 PM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket Samsung and SK Hynix GETTY IMAGES Samsung Electronics and its labor union reached a tentative wage agreement on May 20, 2026, averting an 18-day strike by approximately 48,000 workers at the world's largest memory chipmaker — but the deal has t
2026-05-26
www.ad-hoc-news.de 2026-05-26 AD HOC NEWS
Infineon’s, Trifecta Infineon’s Trifecta: A GaN Patent Victory, a €91 Million EU Consortium, and €2.5 Billion in AI Revenue Ambition 25.05.2026 - 21:51:36 | boerse-global.de Infineon stock hits 52-week high after ITC bans Chinese rival for GaN patent infringement; AI data center revenue projected to reach €2.5B, alongside €91M EU power semiconductor project. Infineon’s Trifecta: A GaN Patent Vic
2026-05-26
www.tweaktown.com 2026-05-26 TweakTown
AMD's Zen 7 'Grimlock' CPUs will reportedly utilize TSMC's 1.4nm 'A14' node and advanced packaging The company is also looking to integrate Powertech's FOPLP advanced packaging technology into the Zen 7 architecture, along with next-gen 3D V-Cache. VIEW GALLERY - 3 Hassam Nasir Tech Reporter Published May 25, 2026 2:50 PM CDT 2 minutes & 30 seconds read time TL;DR: AMD is preparing its Zen 7 "Grim
2026-05-26
www.benzinga.com 2026-05-26 Benzinga
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2026-05-26
www.insidermonkey.com 2026-05-26 Insider Monkey
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2026-05-26
www.cnbc.com 2026-05-26 CNBC
First, welcome to all who have joined us for the first time. Your participation in the CNBC Investing Club means a great deal to us. We aspire to get it right for you, in the same way a wonderful Club member explained this weekend as we gardened together. He couldn’t believe how much he had learned and how much he had prospered from it. I can only express gratitude to him. Here’s why — from 1983 t
2026-05-26
tomshardware.com 2026-05-26 Zhiye Liu
Lisuan Tech reports having sold out 30,,000 preorder LX 7G100 graphics cards with a second batch on June 18.
2026-05-25
www.chosun.com 2026-05-25 조선일보
By Park Ji-min Published 2026.05.26. 00:52 Updated 2026.05.26. 05:35 Samsung Electronics employees pass through a cleanroom semiconductor production site. /Courtesy of Samsung Electronics A tentative agreement between Samsung Electronics' labor and management to provide performance-based bonuses worth hundreds of millions of won is causing significant backlash. In particular, a nearly 100-fold g