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Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng

Alibaba Cloud has unveiled the Zhenwu M890, a new proprietary AI training and inference chip developed by its semiconductor subsidiary T-Head Semiconductor, as the Chinese cloud group accelerates its push into full-stack AI infrastructure for the agentic AI era.

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TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leve

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ICFO spinoff Quside has developed a quantum random number generator chip for secure cryptography applications.

Singapore semiconductor equipment and testing company AEM is facing a dual challenge of "physics and cost" as the AI era rewrites the limits and supply-chain logic of chip testing, CEO Samer Kabbani said. AI is also driving up to US$7 trillion in global infrastructure investment, he said, while forcing the industry to adapt to faster product cycles and far larger, more power-hungry packages.

As AI shifts from training to inference and from single-task use to multi-agent collaboration, South Korea's semiconductor industry is seeking to recast the market around memory rather than GPUs. South Korean academia and industry figures say the AI era will be defined by memory architectures, with the country aiming to build its own framework and challenge an order long dominated by Nvidia.

The PCB industry is entering a new phase of transformation in the AI era, as rising demand for high-frequency and high-speed applications accelerates upgrades in upstream copper-clad laminate (CCL) materials. Among the beneficiaries is impregnation equipment maker Asia Metal Industries (AMI).