onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era - Yahoo Finance

onsemi unveiled its Embedded Power Platform (EPP) on September 16, 2026, marking a significant breakthrough in power system design for the AI era. By using the silicon wafer itself as the package foun... Read original →

onsemi's launch of the Embedded Power Platform (EPP) marks a paradigm shift in power system design, leveraging silicon wafers as packaging foundations to achieve 3–5x higher power density. This innovation redefines packaging from passive to active contributor, integrating Si, SiC, and GaN technologies seamlessly. The move accelerates upstream semiconductor and materials supply chains, particularly benefiting AI infrastructure, EVs, and industrial automation. From a compliance standpoint, EPP reduces reliance on traditional packaging, enhancing supply chain resilience amid U.S.-China tech decoupling. Competitors like Infineon and TI may respond with accelerated platform development, sparking a tech race. Over the next 12–24 months, EPP is poised to become a core architecture in AI data centers and autonomous driving, driving system-level integration across the power semiconductor ecosystem.