Semiconductor News & Analysis Feed
20 articles
2026-09-03
2026-08-27
www.forth.news
2026-08-27
2026-08-27
2026-08-27
2026-08-27
2026-08-27
wtvbam.com
2026-08-27
SK Hynix held a groundbreaking ceremony for a $4 billion AI chip packaging facility in West Lafayette, Indiana, marking a major expansion of its U.S. operations amid surging demand for high-bandwidth memory (HBM) driven by artificial intelligence. The facility, expected to begin cleanroom operations
2026-08-27
www.reuters.com
2026-08-27
2026-08-26
www.newsarticleinsiders.com
2026-08-26
2026-08-25
2026-08-20
en.sedaily.com
2026-08-20
2026-07-31
2026-07-30
www.theinformation.com
2026-07-30
2026-07-29
2026-07-24
seekingalpha.com
2026-07-24
2026-07-06
2026-06-26
biz.chosun.com
2026-06-26
HANMI Semiconductor unveiled its new equipment, the FC Bonder 3.5, designed for artificial intelligence (AI) system semiconductors on June 26, 2026. This device supports 2.5D packaging, enabling the integration of multiple chips such as GPUs, CPUs, and high bandwidth memory (HBM) onto a single subst
2026-06-25
digitimes.com
2026-06-25
Chinese chip packaging leader JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang. This strategic move strengthens JCET's capacity for AI computing, high-performance chips, and
2026-06-05
finance.yahoo.com
2026-06-05
2026-06-03
www.digitimes.com
2026-06-03
Naura Technology Group's launch of its first 600mm × 600mm panel-level packaging descum tool represents a significant breakthrough in China's semiconductor equipment manufacturing capabilities. This advancement marks the company's strategic shift from wafer-level to panel-level packaging, addressing
2026-06-02
news.futunn.com
2026-06-02