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2026-10-19
Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
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digitimes.com 2026-10-19
2026-10-16
BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
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digitimes.com 2026-10-16
2026-10-01
AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote
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digitimes.com 2026-10-01
2026-09-30
CoWoS-L to Remain Leading AI Chip Packaging Technology Through 2028 - EE Times Asia
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news.google.com 2026-09-30
2026-09-19
AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028 - TechPowerUp
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www.techpowerup.com 2026-09-19
2026-09-18
AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028, Says TrendForce - TrendForce
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www.trendforce.com 2026-09-18
2026-09-03
LCY Advanced Materials launches wet chemicals for AI chip packaging
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digitimes.com 2026-09-03
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - Forth.News
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www.forth.news 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - The Mighty 790 KFGO
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kfgo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - KELO-AM
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kelo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - WKZO
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wkzo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - WTVB
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wtvbam.com 2026-08-27
SK Hynix held a groundbreaking ceremony for a $4 billion AI chip packaging facility in West Lafayette, Indiana, marking a major expansion of its U.S. operations amid surging demand for high-bandwidth memory (HBM) driven by artificial intelligence. The facility, expected to begin cleanroom operations
SK HynixAI chipHBM4ESemiconductor manufacturingUS investmentChip packagingArtificial IntelligenceMemory chip
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - Reuters
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www.reuters.com 2026-08-27
2026-08-26
LG Chem to showcase AI chip packaging materials at SEMICON Taiwan - The Korea News Plus
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www.newsarticleinsiders.com 2026-08-26
2026-08-25
NVIDIA’s CoWoS AI Chip Packaging Demand To Be Foreshadowed In 2027 By AMD Due To Agentic AI CPU Ramp, Says Morgan Stanley - Wccftech
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wccftech.com 2026-08-25
2026-08-20
TSMC Turns to Rival Intel for AI Chip Packaging Amid Crunch - Seoul Economic Daily
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en.sedaily.com 2026-08-20
2026-07-31
Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging
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digitimes.com 2026-07-31
2026-07-30
TSMC Develops AI Chip Packaging Tech to Counter Intel - The Information
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www.theinformation.com 2026-07-30
2026-07-29
China's glass substrate supply chain takes shape for AI chip packaging
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digitimes.com 2026-07-29
2026-07-24
Amkor Technology, NVIDIA sign multi-year deal to boost U.S. AI chip packaging - Seeking Alpha
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seekingalpha.com 2026-07-24