Semiconductor News & Analysis Feed
20 articles
2026-06-29
technode.global
2026-06-29
TNGlobal
NVIDIA and Australia’s AI facilitator Firmus Technologies will jointly provide global AI-native, enterprise, and ISV customers access to NVIDIA’s AI accelerated computing stack, with the infrastructure to be deployed at Firmus’ Batam campus in Indonesia.
In a statement on Monday, Firmus said it has reached a partnership with NVIDIA for the move. The Australian firm expects to receive between $25
2026-06-29
digitimes.com
2026-06-29
Global revenue for the semiconductor industry's "Foundry 2.0" market reached US$86 billion in the first quarter of 2026, up 23% year-over-year, driven by strong demand for AI accelerators and advanced packaging, according to Counterpoint Research.
2026-06-25
tomshardware.com
2026-06-25
Luke James
Qualcomm has announced that it will bring all four of its Dragonfly data center product lines to China.
2026-06-25
eetimes.com
2026-06-25
Qualcomm takes the data center by storm with networking, AI accelerators, and both custom and standard CPUs.
2026-06-25
digitimes.com
2026-06-25
OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model developers want to design their own chips and broaden a supply chain long dominated by Nvidia.
2026-06-25
www.constellationr.com
2026-06-25
Constellation Research
Qualcomm outlines new CPU, AI accelerator roadmap, inks deal with Meta
PUBLISHED JUNE 24, 2026
Qualcomm outlined its latest data center offerings including the Qualcomm Dragonfly C1000 CPU, Qualcomm High Bandwidth Compute (HBC) and Qualcomm Dragonfly AI300 inference accelerator. Qualcomm also detailed custom silicon offerings.
The data center roadmap was detailed at Qualcomm's Investor Day. The
2026-06-25
www.servethehome.com
2026-06-25
ServeTheHome
AIServerServer CPUs
Qualcomm Investor Day 2026 Data Center Announcements CPUs, AI Accelerators, and More
By Patrick Kennedy -
June 24, 2026
0
Qualcomm Investor Day 2026 Cover Large
I am here in New York City for Qualcomm Investor Day 2026 (thanks to Qualcomm for covering my travel). This is the event Qualcomm has been talking about as its venue for re-launching its data center offerings. Earlier
2026-06-23
digitimes.com
2026-06-23
Samsung Electro-Mechanics has begun mass production of advanced package substrates for Qualcomm's first data center AI accelerator, extending the companies' supply relationship from mobile and PC chips into server-class semiconductors, ZDNet Koreareported.
2026-06-19
eetimes.com
2026-06-19
The world’s largest hyperscaler wants to seize the semiconductor moment by selling AI accelerators at scale.
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
Qualcomm is in talks to buy RISC-V-based AI accelerator and CPU developer Tenstorrent for $8 billion - $10 billion.
2026-05-27
letsdatascience.com
2026-05-27
Let's Data Science
INFRASTRUCTURE
broadcom
furiosaai
ai accelerators
advanced packaging
Broadcom Adds FuriosaAI for Custom AI Accelerators
2 sources
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May 27, 2026
6.8
Relevance Score
Photo: image.theregister.com · rights & takedowns
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Broadcom has added South Korea's FuriosaAI to its roster of partners building AI accelerators on Broadcom's packaging and networking technology, The Register reports
2026-05-27
www.indexbox.io
2026-05-27
IndexBox
Thermal management has become the primary limiting factor in high-performance computing and AI accelerator packaging. Contemporary packages combine high-power ASICs with multiple High Bandwidth Memory stacks on a silicon interposer, resulting in closely linked thermal and mechanical interactions. Thermal crosstalk between dies increases HBM junction temperatures, while mismatched coefficients of t
2026-05-26
www.chosun.com
2026-05-26
조선일보
By Seongmin K
Published 2026.05.27. 00:34
Concept diagram of SK Hynix's iHBM technology. ICE, a thermal control element, serves as a passage for heat dissipation. /SK Hynix
SK Hynix unveiled on the 26th its "iHBM" technology, which significantly reduces heat generation in high-bandwidth memory (HBM) used in AI accelerators.
As demand for AI computations rises, the workload of HBM mounted on AI
2026-05-19
www.openpr.com
2026-05-19
openPR.com
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2026-05-19
dataconomy.com
2026-05-19
Dataconomy
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2026-05-12
www.openpr.com
2026-05-12
openPR.com
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2026-05-12
semiengineering.com
2026-05-12
Laura Peters
Multi-die assemblies greatly increase the number of things that can go wrong, and the d...
2026-05-11
www.techradar.com
2026-05-11
TechRadar
Copy linkFacebookXWhatsappRedditPinterestFlipboardThreadsEmailShare this article0Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterSkymizer claims giant AI models no longer need hyperscale GPU infrastructureOld 28nm chips suddenly power massive language models at surprisingly low wattageThe HTX301 squeezes 384 GB of memory into a single PCIe a
2026-05-07
wccftech.com
2026-05-07
Wccftech
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2026-05-06
www.openpr.com
2026-05-06
openPR.com
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