Semiconductor News & Analysis Feed
11735 articles
2026-04-23
eetimes.com
2026-04-23
Pablo Valerio
The telecom sector's survival hinges on rapid software automation to counteract soaring hardware costs fueled by the booming AI demand.
2026-04-23
semiengineering.com
2026-04-23
Ann Mutschler
As models evolve faster than silicon cycles, experts weigh how much adaptability archit...
2026-04-17
eetimes.com
2026-04-17
Alan Patterson
TSMC slams the gas to expand chip production for AI giants, but shortages loom.
2026-04-17
eetimes.com
2026-04-17
Pablo Valerio
EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction.
2026-04-16
semiengineering.com
2026-04-16
Bryon Moyer
They're necessary, but insufficient for a marketplace.
2026-04-09
eetimes.com
2026-04-09
Pablo Valerio
“Terafab is likely an Intel fab expansion, with Tesla, SpaceX, and xAI as anchor customers, rather than a standalone venture,” said Yole analyst Adrien Sánchez.
2026-04-09
eetimes.com
2026-04-09
Pat Brans
As the Nexperia episode sharpens Europe’s focus, experts say resilience will hinge on application relevance, supply chain depth, and smarter investment priorities.
2026-04-03
eetimes.com
2026-04-03
Emily Newton
Hardware shortages are stimulating the AI chip counterfeit market. Experts believe a hardware root of trust could alleviate authenticity and security challenges.
2026-04-02
eetimes.com
2026-04-02
Zaheer Ali
Why transatlantic execution, not transatlantic symbolism, now matters to the electronics and semiconductor supply chain.
2026-04-01
eetimes.com
2026-04-01
Pablo Valerio
Alibaba is directly challenging global chip leaders by leveraging open-standard architecture to redefine the AI hardware landscape.
2026-03-25
eetimes.com
2026-03-25
Pablo Valerio
The economics of the global memory market are being fundamentally rewritten by the AI supercycle and catastrophic Middle East supply disruptions.
digitimes.com
Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se
digitimes.com
Industrial factories are likely to become the first major market for robots at scale, according to Rafael Sotomayor, NXP President and CEO, who said manufacturers want stable systems, dependable performance, and clear financial returns. This view suggests that the earliest gains from robotics may come in places where efficiency improvements are easiest to measure.
digitimes.com
SambaNova used a Computex 2026 session on June 4 to make its most public case yet that the GPU-only approach to AI inference is hitting a fundamental wall — and to demonstrate, live on stage, an alternative architecture it calls disaggregated inference running in a production data center.
digitimes.com
As artificial intelligence (AI) workloads place unprecedented demands on data storage systems, South Korean SSD controller designer FADU is betting that next-generation storage architecture will become a critical battleground in the AI infrastructure race.