semiengineering.com
2026-08-11
Co-Packaged Optics (CPO) is emerging as a key technology in next-generation computing, particularly in AI data centers, where it offers higher bandwidth, lower power consumption, and reduced latency. However, the widespread adoption of CPO is hindered by a lack of standardization in testing processe
www.storagenewsletter.com
2026-08-05
At the 2026 Future of Memory and Storage (FMS) conference, SanDisk and SK Hynix announced the release of the High Bandwidth Flash (HBF) technical specification through the Open Compute Project (OCP), marking a significant step toward standardizing HBF for the AI inference era. This specification add