SemiPulse — Semiconductor Intelligence

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The opportunity clock is ticking for Malaysia’s advanced packaging - Tech Wire Asia

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techwireasia.com 2026-05-07 Tech Wire Asia

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ASYS Q1 Deep Dive: AI Demand and Advanced Packaging Drive Revenue Growth and Guidance Upside - StockStory

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stockstory.org 2026-05-07 StockStory

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Intel shifts data center chip packaging to Vietnam and expands EMIB advanced packaging integration - digitimes

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www.digitimes.com 2026-05-07 digitimes

Intel is relocating a data center chip production line from Costa Rica to its Vietnam facility. The move, flagged in a Saigon Hi-Tech Park management board report to the Ho Chi Minh City People's Committee and cited byThe Investorand VN Economy,...The article requires paid subscription.Subscribe Now

Intel data center chips Vietnam manufacturing chip packaging EMIB semiconductor manufacturing supply chain relocation semiconductor industry

Applied Materials buys ASMPT’s NEXX to boost panel-level chip packaging - CHOSUNBIZ - Chosunbiz

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biz.chosun.com 2026-05-07 Chosunbiz

KR JP Industry Finance Real Estate IT Retail Science Policy Society International Entertainment Culture Sports English IT Applied Materials buys ASMPT's NEXX to boost panel-level chip packaging By Jeong Du-yong Published 2026.05.07. 10:08 /Courtesy of Applied Materials Semiconductor equipment corporations Applied Materials said on the 7th that it signed a definitive agreement with ASMPT to acqui

Semiconductor Equipment Chip Packaging Panel-Level Packaging Applied Materials ASMPT NEXX Advanced Packaging Semiconductor Industry

Intel targets entry-level advanced packaging, draws interest from Google and Amazon - digitimes

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www.digitimes.com 2026-05-07 digitimes

Over the past decade, market assessments of Intel have largely been confined to a single lens: execution in advanced process technology. By that metric, Intel has struggled, with delays in 10nm and setbacks at the 7nm node, leading to the loss of Apple's chip...The article requires paid subscription.Subscribe Now

Intel Advanced Packaging Semiconductor Manufacturing Chip Technology Google Amazon Wafer Fab Semiconductor Industry

Applied Materials NEXX Deal Expands AI Packaging Growth Story - simplywall.st

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simplywall.st 2026-05-07 simplywall.st

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Kulicke & Soffa earnings up next as advanced packaging gains By Investing.com - Investing.com South Africa

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za.investing.com 2026-05-07 Investing.com South Africa

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Kulicke & Soffa earnings up next as advanced packaging gains By Investing.com - Investing.com Nigeria

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ng.investing.com 2026-05-07 Investing.com Nigeria

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Kulicke & Soffa earnings up next as advanced packaging gains By Investing.com - Investing.com UK

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uk.investing.com 2026-05-07 Investing.com UK

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Kulicke & Soffa earnings up next as advanced packaging gains - Investing.com

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www.investing.com 2026-05-07 Investing.com

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AI Chip Packaging Constraints Create an Opening for Intel’s EMIB Technology - 24/7 Wall St.

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247wallst.com 2026-05-06 24/7 Wall St.

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Applied Materials Expands AI Packaging With NEXX Deal As Stock Surges - Yahoo Finance

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finance.yahoo.com 2026-05-06 Yahoo Finance

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Hana Micron bets on advanced packaging for global expansion - 매일경제

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pulse.mk.co.kr 2026-05-06 매일경제

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India approves new semiconductor and Mini/Micro LED projects

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digitimes.com 2026-05-06

India's latest approvals could expand global display and chip sourcing as the country adds Mini/Micro LED GaN fabrication and large-scale packaging capacity. Global manufacturers and buyers may see new sourcing options as India deepens its production capabilities for displays, power devices, and automotive components.