Semiconductor News & Analysis Feed
614 articles
2026-06-29
digitimes.com
2026-06-29
Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment and semiconductor equipment spending lift demand for ceramic parts, optical communication packages, and advanced semiconductor packaging materials.
2026-06-29
digitimes.com
2026-06-29
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment of a former TSMC executive as an independent director by Chairman Chiang Shang-yi has also drawn industry attention to the commercialization progress of its high-speed optical transceiver business.
2026-06-29
digitimes.com
2026-06-29
Global revenue for the semiconductor industry's "Foundry 2.0" market reached US$86 billion in the first quarter of 2026, up 23% year-over-year, driven by strong demand for AI accelerators and advanced packaging, according to Counterpoint Research.
2026-06-28
news.futunn.com
2026-06-28
富途牛牛
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2026-06-28
digitimes.com
2026-06-28
LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as demand tied to artificial intelligence chips accelerates, Herald Businessreported.
2026-06-28
www.insidermonkey.com
2026-06-28
Insider Monkey
NEWS
Taiwan Semiconductor (TSM), Amkor (AMKR) Form 10-Year Partnership for Advanced Semiconductor Packaging in Arizona
Published on June 27, 2026 at 12:15 pm by MAHAM FATIMA in News
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the best future stocks to buy and hold for 10 years. On June 16, TSMC and Amkor Technology entered into a 10-year partnership to expand adv
2026-06-28
finance.yahoo.com
2026-06-28
Yahoo Finance
Taiwan Semiconductor (TSM), Amkor (AMKR) Form 10-Year Partnership for Advanced Semiconductor Packaging in Arizona
Maham Fatima
June 27, 2026 2 min read
2330.TW
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AMKR
+0.33%
TSM
+4.06%
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the best future stocks to buy and hold for 10 years. On June 16, TSMC and Amkor Technology
2026-06-27
simplywall.st
2026-06-27
simplywall.st
United States/Semiconductors/NasdaqGS:KLIC
Kulicke And Soffa Industries (KLIC) Following Advanced Packaging Demand Is The Rally Already Priced In
June 27, 2026
Simply Wall St
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Advanced packaging demand puts Kulicke and Soffa Industries (KLIC) in focus
Kulicke and Soffa Industries (KLIC) is drawing fresh investor attention as strong demand for its Thermo Compression Bo
2026-06-27
www.digitimes.com
2026-06-27
digitimes
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply...
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2026-06-27
news.futunn.com
2026-06-27
富途牛牛
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2026-06-27
digitimes.com
2026-06-27
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging, testing, and optoelectronic integration capabilities under Foxconn's "3+3+3" strategy to seize advanced packaging opportunities in AI optical communications.
2026-06-27
digitimes.com
2026-06-27
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
2026-06-27
digitimes.com
2026-06-27
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.
2026-06-27
www.asiae.co.kr
2026-06-27
아시아경제
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2026-06-27
www.msn.com
2026-06-27
MSN
Applied Materials (AMAT) held a master class event this week, and much of the focus was on the company's positioning in dynamic random access memory and advanced packaging, Wall Street analysts said.
“In our view, these insights reflect broader tech trends reshaping the entire semi supply chain,” Susquehanna analyst Mehdi Hosseini wrote in a note to clients. “The rising complexity of next-gen DRA
2026-06-26
seekingalpha.com
2026-06-26
Seeking Alpha
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2026-06-26
www.semiconductor-today.com
2026-06-26
Semiconductor Today
The demand for higher power densities in increasingly space-constrained environments continues to grow, whether in on-board chargers for electric vehicles or power supplies for AI data centers. At the recent PCIM Europe 2026 (Power Electronics, Intelligent Motion, Renewable Energy and Energy Management) Expo & Conference in Nuremberg, Germany (9–11 June), Munich-based Infineon Technologies AG henc
2026-06-26
simplywall.st
2026-06-26
simplywall.st
United States/Semiconductors/NasdaqGS:AMAT
Applied Materials (AMAT) Unveils AI Chip Tools For 3D Memory And Packaging
June 26, 2026
Simply Wall St
Reviewed by Bailey Pemberton
Applied Materials (NasdaqGS:AMAT) has introduced a new suite of chipmaking systems focused on advanced 3D chip architectures for AI.
The platforms target high bandwidth memory, 3D DRAM structures, advanced packaging, and pro
2026-06-26
en.sedaily.com
2026-06-26
Seoul Economic Daily
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2026-06-26
en.sedaily.com
2026-06-26
Seoul Economic Daily
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