199 articles
2026-05-13
www.insidermonkey.com
2026-05-13
Insider Monkey
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2026-05-13
finance.yahoo.com
2026-05-13
Yahoo Finance
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2026-05-13
www.bisinfotech.com
2026-05-13
Bisinfotech
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2026-05-13
digitimes.com
2026-05-13
Ableprint reported record first-quarter 2026 revenue and profit as customers installed and qualified new advanced packaging production lines and expanded shipments of high-end process equipment, with the company saying demand tied to co-packaged optics started to convert into orders. The firm posted net profit after tax of NT$415 million, up 82.1% year on year, and first-quarter revenue rose 81.9%
2026-05-13
digitimes.com
2026-05-13
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second half of 2026, with the systems expected to be used in the mass production of networking chips for SpaceX.
2026-05-13
digitimes.com
2026-05-13
Of the 238 Taiwan-listed semiconductor and related companies tracked by Digitimes,73% (173 companies)posted positive year-on-year revenue growth in April 2026, and58% (139)grew month-over-month. Memory makers, AI server assemblers, and advanced packaging houses led the advance, while silicon wafer suppliers and a handful of fabless names faced ongoing headwinds.
2026-05-13
digitimes.com
2026-05-13
Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net profit after tax for the quarter reached NT$505 million (approx. US$16.03 million), up 1% from the previous quarter and 186.37% from a year earlier, while earnings per share (EPS) came to NT$0.72, the highest in the p
2026-05-13
digitimes.com
2026-05-13
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn
2026-05-12
newshub.medianet.com.au
2026-05-12
Medianet News Hub
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2026-05-12
pressreleasehub.pa.media
2026-05-12
PA Media
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2026-05-12
news.google.com
2026-05-12
Business Wire
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2026-05-12
www.morningstar.com
2026-05-12
Morningstar
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2026-05-12
www.thelec.net
2026-05-12
thelec.net
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2026-05-12
www.trendforce.com
2026-05-12
TrendForce
HomeNews
2026-05-12
ca.finance.yahoo.com
2026-05-12
Yahoo! Finance Canada
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2026-05-12
drrobertcastellano.substack.com
2026-05-12
Dr. Robert Castellano's Semiconductor Deep Dive Newsletter
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2026-05-12
digitimes.com
2026-05-12
With TSMC capacity under mounting supply-demand pressure, Intel — once written off by many as a company fighting for survival — is staging a credible comeback.
2026-05-12
digitimes.com
2026-05-12
Arm is preparing to expand beyond its traditional IP licensing business by introducing data center CPUs, positioning itself to compete directly with some of its own customers, including AWS, Google, and Nvidia, while maintaining rapid growth in licensing revenue driven by rising demand for AI infrastructure.
2026-05-12
digitimes.com
2026-05-12
Taiwan's semiconductor testing and probe card supply chain maintained solid momentum entering 2026, driven by continued AI accelerator, high-performance computing (HPC), and advanced packaging demand.
2026-05-12
digitimes.com
2026-05-12
Taiwan-based semiconductor facility engineering firm Trusval reported strong results for the first quarter of 2026, supported by continued growth in global AI computing demand, TSMC's accelerated expansion of 2nm process and advanced packaging capacity, and ongoing fab construction projects across the semiconductor, high-tech, and memory industries.